表面贴装焊点的热膨胀控制可靠

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75955

W. Engelmaier

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引用次数: 3

摘要

表面安装组件的焊点的可靠性一直是人们关注的问题。这种担忧源于热致焊点疲劳的相互作用机制的非常复杂和鲜为人知的性质，以及加速可靠性测试的高度变化性质和经常相互矛盾的结果。讨论了问题的性质。在加速可靠性测试结果的背景下，强调了不同类型的表面贴装附件。讨论了加速可靠性试验问题，给出了试验方案。还提出了提高焊点可靠性的方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Surface mount solder joint reliability controlling the thermal expansion

The reliability of the solder joints of surface-mounted assemblies is a continuing concern. This concern stems from the very complex and little understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly varying nature of accelerated reliability testing and the frequently contradictory results. The nature of the problem is discussed. The different types of surface-mount attachments are highlighted in the context of accelerated reliability test results. Accelerated reliability test concerns are discussed and testing options given. Options for increased solder-joint reliability are also suggested.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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