用于高性能封装的金属基板玻璃陶瓷

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75943

E. A. Logan, D. Holland, J. Thorp, G. Partridge

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引用次数: 0

摘要

几种金属玻璃陶瓷涂层已经被评估，以满足对高导热基板的需求。衬底材料的选择和处理使其热膨胀系数与硅相似，从而避免在热循环期间在器件中产生应力。玻璃陶瓷与金属的热膨胀匹配是通过控制已知热膨胀系数相的结晶来实现的。这已被x射线和显微结构检查所证实，在铜/Invar/铜上的铝硅酸锂型玻璃陶瓷和在钼和钨上的铝硅酸镁型玻璃陶瓷的相对介电常数分别为5.9和5.8,tan δ值在10/sup -3/和10/sup -2/.>之间

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Glass-ceramic on metal substrates for high performance packaging

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass-ceramic to the metal is achieved by the controlled crystallization of phases of known thermal expansion coefficients. This has been confirmed by X-ray and microstructural examination of a lithium aluminosilicate type glass-ceramic on copper/Invar/copper and of a magnesium aluminosilicate type glass-ceramic on molybdenum and on tungsten give values for the relative permittivity of the glass-ceramic layer of 5.9 and 5.8 respectively and values for tan delta between 10/sup -3/ and 10/sup -2/.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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