IEEE Transactions on Very Large Scale Integration (VLSI) Systems最新文献_第5页

An Implementation of Reconfigurable Match Table for FPGA-Based Programmable Switches 基于 FPGA 的可编程开关的可重构匹配表的实现

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-07 DOI: 10.1109/TVLSI.2024.3436047

Xiaoyong Song;Zhichuan Guo

{"title":"An Implementation of Reconfigurable Match Table for FPGA-Based Programmable Switches","authors":"Xiaoyong Song;Zhichuan Guo","doi":"10.1109/TVLSI.2024.3436047","DOIUrl":"10.1109/TVLSI.2024.3436047","url":null,"abstract":"Match table is the key part to perform packet processing and forwarding for programmable switches in a software-defined network (SDN). However, the match table in current field-programmable gate array (FPGA)-based switches is inflexible or undisclosed. When the network function changes, the match table on FPGA needs to be redesigned or reset size parameters, and after recompilation and reimplementation, it could work again; this time-consuming and labor-intensive operation seriously reduces the flexibility and configurability of the switch. To address this issue, this article presents a design of reconfigurable match table (RMT) for FPGA-based programmable switches. A three-layer table structure is introduced to realize the reconfiguration and hardware-plane mapping of user-defined tables, and the logical tables in packet processing pipeline are interconnected with the physical tables in memory pool by the designed resource-efficient segment crossbar. To the best of our knowledge, this article is the first to publicly present the entire FPGA-based RMT design scheme and implementation details. The proposed design implements reconfigurable ternary content addressable memory (TCAM) based and static random access memory (SRAM) based match tables on Xilinx FPGA and verifies them with a packet filter system. In the proposed RMT system, a user could reconfigure the number, depth, and width of user-defined match tables (UMTs) in pipeline via control plane without modifying hardware, which enhances the flexibility of the data plane of FPGA-based switch greatly.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8,"publicationDate":"2024-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141939169","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A High-Precision and High-Dynamic-Range Current-Mode WTA Circuit for Low-Supply-Voltage Applications 用于低电压应用的高精度、高动态范围电流模式 WTA 电路

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-07 DOI: 10.1109/TVLSI.2024.3436575

Mehdi Saberi;Hossein Yaghoobzadeh Shadmehri;Mohammad Tavakkoli Ghouchani;Alexandre Schmid

{"title":"A High-Precision and High-Dynamic-Range Current-Mode WTA Circuit for Low-Supply-Voltage Applications","authors":"Mehdi Saberi;Hossein Yaghoobzadeh Shadmehri;Mohammad Tavakkoli Ghouchani;Alexandre Schmid","doi":"10.1109/TVLSI.2024.3436575","DOIUrl":"10.1109/TVLSI.2024.3436575","url":null,"abstract":"This brief proposes a low-voltage, high-precision, and high-dynamic-range current-mode analog winner-take-all (WTA) circuit. The proposed structure employs a new high-gain stage as a feedback network between the input node of each cell and the common node of the circuit to reduce the sensitivity of the output current to the loser signals, especially when they are close to the winner. In addition, another network is employed that senses the amount of the output/winner current and adjusts the bias current of the gain stages. This ensures that the drain-source voltage of the input transistor in the winner cell matches the behavior of the output transistor’s drain-source voltage, enhancing the accuracy as well as the input dynamic range (DR) of the structure. Moreover, since the circuit works properly with a minimum supply voltage of only \u0000<inline-formula> <tex-math>$V_{text {GS}} + V_{text {eff}}$ </tex-math></inline-formula>\u0000, it is a promising candidate for applications in emerging technologies with low supply voltage requirements. Based on the proposed structure, a three-input WTA circuit is designed and fabricated in a 0.18-\u0000<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>\u0000 m CMOS technology. According to the measurement results, the proposed circuit exhibits a maximum error of 1.5% for the input signal range of \u0000<inline-formula> <tex-math>$60~mu $ </tex-math></inline-formula>\u0000 A when the input frequency is 100 kHz. The silicon area occupied by the circuit is \u0000<inline-formula> <tex-math>$33~mu $ </tex-math></inline-formula>\u0000 m \u0000<inline-formula> <tex-math>$times 65~mu $ </tex-math></inline-formula>\u0000 m.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8,"publicationDate":"2024-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141939171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thresholding Decision-Directed Descent (T3D): A Tuning Solution for DDR5 DRAM DFEs 阈值决策定向下降 (T3D)：DDR5 DRAM DFE 的调整解决方案

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-06 DOI: 10.1109/TVLSI.2024.3435419

Mitchell Cooke;Nicola Nicolici

引用次数: 0

High-Performance Error and Erasure Decoding With Low Complexities Using SPC-RS Concatenated Codes 利用 SPC-RS 连接编码实现低复杂度的高性能纠错和擦除解码

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-06 DOI: 10.1109/tvlsi.2024.3435773

Zhihao Zhou, Wei Zhang, Xinyi Guo, Jianhan Zhao, Yanyan Liu

引用次数: 0

Low-Jitter Frequency Doubling Circuit Supporting Higher-Speed BISG and Aging Sensing in a Chiplet-Based Design Environment 基于 Chiplet 的设计环境中支持更高速 BISG 和老化传感的低抖动倍频电路

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-05 DOI: 10.1109/tvlsi.2024.3435059

Ko-Hong Lin, Ont-Derh Lin, Shi-Yu Huang, Duo Sheng

引用次数: 0

A High-Speed Dynamic Element Matching Decoder With Integrated Background Calibration Control 集成背景校准控制的高速动态元素匹配解码器

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-07-30 DOI: 10.1109/TVLSI.2024.3432640

Tobias Schirmer;Simon Buhr;Felix Burkhardt;Florian Protze;Frank Ellinger

{"title":"A High-Speed Dynamic Element Matching Decoder With Integrated Background Calibration Control","authors":"Tobias Schirmer;Simon Buhr;Felix Burkhardt;Florian Protze;Frank Ellinger","doi":"10.1109/TVLSI.2024.3432640","DOIUrl":"10.1109/TVLSI.2024.3432640","url":null,"abstract":"A dynamic element matching (DEM) decoder with integrated mismatch calibration control for high-speed current-steering digital-to-analog converters (CS-DACs) and CSDAC- based direct digital frequency synthesizers (DDFSs) is studied and presented. The DEM algorithm achieves very good averaging of mismatch-induced errors in the succeeding CS-DAC. It features a minimum element transition rate, therefore opimizing the power dissipation and ensuring minimal glitch energy at the output. Due to the chosen network-based architecture, with only a few modifications of the hardware, the decoder allows the integration of a comprehensive current source mismatch calibration that can be fully operated in the background and even in parallel to the regular DEM operation. A proof-ofconcept hardware implementation of the presented decoder was fabricated in a 22-nm FD-SOI CMOS process and characterized in a high-speed DDFS system with a sampling rate of 5 GHz. Measurements reveal a significant improvement in the spurious free dynamic range (SFDR) and signal-to-noise-and-distortion ratio (SNDR) when the calibration and DEM are enabled. Compared to the state-of-the-art (SoA), the presented DDFS achieves one of the best figures of merit.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8,"publicationDate":"2024-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141867464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An Efficient Two-Stage Pipelined Compute-in-Memory Macro for Accelerating Transformer Feed-Forward Networks 用于加速变压器前馈网络的高效两级流水线内存计算宏程序

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-07-29 DOI: 10.1109/TVLSI.2024.3432403

Heng Zhang;Wenhe Yin;Sunan He;Yuan Du;Li Du

{"title":"An Efficient Two-Stage Pipelined Compute-in-Memory Macro for Accelerating Transformer Feed-Forward Networks","authors":"Heng Zhang;Wenhe Yin;Sunan He;Yuan Du;Li Du","doi":"10.1109/TVLSI.2024.3432403","DOIUrl":"10.1109/TVLSI.2024.3432403","url":null,"abstract":"Transformer architectures have achieved state-of-the-art performance in various applications. However, deploying transformer models on resource-constrained platforms is still challenging due to its dynamic workloads, intensive computations, and substantial memory access. In this article, we propose a two-stage pipelined compute-in-memory (CIM) macro for effectively deploying and accelerating the feed-forward network (FFN) layers of transformer models. Two independent CIM arrays are designed to execute the two distinct linear projections in FFN layers, which are interconnected by co-designed analog rectified linear unit (ReLU) circuits to realize the nonlinear activation function. The analog multiply-and-add (MAC) results from the first CIM array are streamed directly to the analog ReLU circuits, and subsequently to the next CIM array for performing another linear projection. This architecture eliminates the need for analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) for internal results’ staging, thereby enhancing overall macro efficiency and reducing computing latency. A proof-of-concept macro is fabricated using TSMC 65-nm process and achieves 4.096 TOPS peak throughput, 4.39 TOPS/mm2 area efficiency, and 49.83 TOPS/W energy efficiency. To map transformer models onto the proposed macro, we quantize the FFN layers of BERTMINI model under per-token granularity for activations and per-tensor granularity for weights using quantization-aware training (QAT), which exhibits excellent accuracy across multiple benchmarks.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141867412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Low-Cost Quadruple-Node-Upsets Resilient Latch Design 低成本四重节点镦粗弹性锁存器设计

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-07-29 DOI: 10.1109/TVLSI.2024.3430224

Luchang He;Chenchen Xie;Qingyu Wu;Siqiu Xu;Houpeng Chen;Xing Ding;Xi Li;Zhitang Song

引用次数: 0

An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems 芯片组异构集成系统的电热协同仿真模型

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-07-29 DOI: 10.1109/TVLSI.2024.3430498

Xiaoning Ma;Qinzhi Xu;Chenghan Wang;He Cao;Jianyun Liu;Daoqing Zhang;Zhiqiang Li

{"title":"An Electrical-Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems","authors":"Xiaoning Ma;Qinzhi Xu;Chenghan Wang;He Cao;Jianyun Liu;Daoqing Zhang;Zhiqiang Li","doi":"10.1109/TVLSI.2024.3430498","DOIUrl":"10.1109/TVLSI.2024.3430498","url":null,"abstract":"Chiplet heterogeneous integration (CHI) is one of the important technology choices to continue Moore’s law. However, due to the characteristics of high power and low supply voltage in CHI systems, heavy currents need to flow through the power delivery network (PDN), and the Joule heating effect will result in the overall temperature increase of the CHI system. Meanwhile, the high temperature will cause the current as well as the performance of the system to degrade and a series of reliability problems will occur. In this article, an effective electrical-thermal coupling model is proposed to predict the steady-state temperature distribution of a 2.5-D CHI system considering the Joule heating effect and the temperature effect on the IR drop. The equivalent electrical conductivity model is also built up to describe the design features of the redistribution layer (RDL), bump, and through silicon via (TSV) structures based on the electrical-thermal duality. Furthermore, the governing equations for voltage distribution and temperature distribution are solved simultaneously by utilizing the finite volume method (FVM) with nonuniform mesh to realize the electrical-thermal co-simulation of the multiscale CHI system. The model application is further performed to investigate the influence of the model parameters on the voltage drop and temperature distribution of the CHI system. The verified systems and simulated results of the present investigation demonstrate the viability and accuracy of voltage and temperature field co-simulation and indicate that the new proposed electrical-thermal model is helpful in thermal and voltage drop analysis of packaging structures with the Joule heating effect and can be adopted to assist in the physical design optimization of 2.5-D CHI or 3-D heterogeneous stacked chips.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":null,"pages":null},"PeriodicalIF":2.8,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141867469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A 370-nW Bio-AFE With 2.9-$mu$Vrms Input Noise in an Octa-Channel System-in-Package for Multimode Bio-Signal Acquisition 用于多模生物信号采集的八通道系统级封装中的 370-nW Bio-AFE，输入噪声为 2.9 美元/毫微伏

IF 2.8 2区工程技术

IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-07-29 DOI: 10.1109/tvlsi.2024.3430059

Patrick Fath, Harald Pretl

引用次数: 0