Design of a Low-Power Analog Integrated Deep Convolutional Neural Network

IF 3.1 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Zisis Foufas;Vassilis Alimisis;Paul P. Sotiriadis
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引用次数: 0

Abstract

In this article, a framework for the analog implementation of a deep convolutional neural network (CNN) is introduced and used to derive a new circuit architecture which is composed of an improved analog multiplier and circuit blocks implementing the ReLU activation function and the argmax operator. The operating principles of the individual blocks, as well as those of the complete architecture, are analyzed and used to realize a low-power analog classifier, consuming less than $1.8~\mu \text {W}$ . The proper operation of the classifier is verified via a comparison with a software equivalent implementation and its performance is evaluated against existing circuit architectures. The proposed architecture is implemented in a TSMC 90-nm CMOS process and simulated using Cadence IC Suite for both schematic and layout design. Corner and Monte Carlo mismatch simulations of the schematic and the physical circuit (postlayout) were conducted to evaluate the effect of transistor mismatches and process voltage temperature (PVT) variations and to showcase a proposed systematic method for offsetting their effect.
低功耗模拟集成深度卷积神经网络的设计
本文介绍了一种深度卷积神经网络(CNN)的模拟实现框架,并利用该框架推导了一种新的电路结构,该结构由改进的模拟乘法器和实现ReLU激活函数和argmax算子的电路块组成。分析了各个模块的工作原理,以及整个体系结构的工作原理,并用于实现低功耗模拟分类器,功耗小于1.8~\mu \text {W}$。通过与软件等效实现的比较验证了分类器的正确运行,并根据现有电路架构评估了其性能。提出的架构在台积电90纳米CMOS工艺中实现,并使用Cadence IC Suite进行原理图和版图设计仿真。对原理图和物理电路(后布局)进行角和蒙特卡罗失配模拟,以评估晶体管失配和工艺电压温度(PVT)变化的影响,并展示一种拟议的系统方法来抵消它们的影响。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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