2016 IEEE Symposium on VLSI Technology最新文献

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Deep insight into process-induced pre-existing traps and PBTI stress-induced trap generations in high-k gate dielectrics through systematic RTN characterizations and ab initio calculations 通过系统的RTN表征和从头计算,深入了解高k栅极介质中工艺诱导的预先存在陷阱和PBTI应力诱导的陷阱
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573373
Jiezhi Chen, Y. Nakasaki, Y. Mitani
{"title":"Deep insight into process-induced pre-existing traps and PBTI stress-induced trap generations in high-k gate dielectrics through systematic RTN characterizations and ab initio calculations","authors":"Jiezhi Chen, Y. Nakasaki, Y. Mitani","doi":"10.1109/VLSIT.2016.7573373","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573373","url":null,"abstract":"In this work, aiming at comprehensive understandings on pre-existing traps and stress-induced trap generations, HfSiON and HfLaSiON nFETs are comparatively studied by using the constant bias random telegraph noise (cRTN) and the transient RTN (tRTN) characterizations. With La incorporation, low frequency noise is suppressed due to lower deep trap densities while BTI degrades due to shallow traps increasing. More importantly, it is experimentally observed for the first time that PBTI stress will generate deep traps dramatically while shallow traps partly lost simultaneously. Based on the first-principles calculations, underlying mechanisms are discussed and a new model is proposed for PBTI in high-k gate stack nFETs.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115355873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Scalability of InGaAs gate-all-around FET integrated on 300mm Si platform: Demonstration of channel width down to 7nm and Lg down to 36nm 在300mm Si平台上集成InGaAs栅极全能场效应管的可扩展性:通道宽度降至7nm, Lg降至36nm的演示
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573420
X. Zhou, N. Waldron, G. Boccardi, F. Sebaai, C. Merckling, G. Eneman, S. Sioncke, L. Nyns, A. Opdebeeck, J. Maes, Q. Xie, M. Givens, F. Tang, X. Jiang, W. Guo, B. Kunert, L. Teugels, K. Devriendt, A. S. Hernandez, J. Franco, D. V. van Dorp, K. Barla, N. Collaert, A. Thean
{"title":"Scalability of InGaAs gate-all-around FET integrated on 300mm Si platform: Demonstration of channel width down to 7nm and Lg down to 36nm","authors":"X. Zhou, N. Waldron, G. Boccardi, F. Sebaai, C. Merckling, G. Eneman, S. Sioncke, L. Nyns, A. Opdebeeck, J. Maes, Q. Xie, M. Givens, F. Tang, X. Jiang, W. Guo, B. Kunert, L. Teugels, K. Devriendt, A. S. Hernandez, J. Franco, D. V. van Dorp, K. Barla, N. Collaert, A. Thean","doi":"10.1109/VLSIT.2016.7573420","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573420","url":null,"abstract":"We report In<sub>0.53</sub>GaAs-channel gate-all-around FETs with channel width down to 7nm and L<sub>g</sub> down to 36nm, the smallest dimensions reported to date for IIIV devices fabricated on 300mm Si wafer. Furthermore, we systematically study the device scalability. InGaAs S/D improves the peak g<sub>m</sub> by 25% compared to InAs S/D. A g<sub>m</sub> of 1310 μS/μm with an SS<sub>sat</sub> of 82mV/dec is achieved for an L<sub>g</sub>=46nm device. At this L<sub>g</sub>, a record I<sub>on</sub> above 200μA/μm is obtained at I<sub>off</sub> of 100nA/μm and V<sub>ds</sub>=0.5V on a 300mm Si platform.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"279 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114611517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
The age of sensors - How MEMS sensors will enable the next wave of new products. 传感器的时代- MEMS传感器将如何使下一波新产品成为可能。
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573357
S. Lloyd, M. Lim
{"title":"The age of sensors - How MEMS sensors will enable the next wave of new products.","authors":"S. Lloyd, M. Lim","doi":"10.1109/VLSIT.2016.7573357","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573357","url":null,"abstract":"This paper covers a brief history of MEMS and the current status of mainstream MEMS sensors, then goes on to discuss how the availability of these low cost ubiquitous sensors is enabling several major market inflections. These inflections often require complete ecosystems to be developed, from unique technologies that enable new capabilities at the component level, to disruptive new services for end customers. However, value is disproportionally captured by companies supplying the end service, and not by those supplying the core fundamental components. The fact that relatively low cost “commodity” parts can enable these inflections and help create massive new value underlines the challenges being faced by many semiconductor companies. To drive growth, component suppliers need to find a way to capture more value from the inflections they enable.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125231670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation 超低电阻率CMOS接触方案与预接触非晶化加钛(锗)硅化
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573381
H. Yu, M. Schaekers, A. Hikavyy, E. Rosseel, A. Peter, K. Hollar, F. Khaja, W. Aderhold, L. Date, A. Mayur, J. lee, K. Shin, B. Douhard, S. Chew, S. Demuynck, S. Kubicek, D. Kim, A. Mocuta, K. Barla, N. Horiguchi, N. Collaert, A. Thean, K. De Meyer
{"title":"Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation","authors":"H. Yu, M. Schaekers, A. Hikavyy, E. Rosseel, A. Peter, K. Hollar, F. Khaja, W. Aderhold, L. Date, A. Mayur, J. lee, K. Shin, B. Douhard, S. Chew, S. Demuynck, S. Kubicek, D. Kim, A. Mocuta, K. Barla, N. Horiguchi, N. Collaert, A. Thean, K. De Meyer","doi":"10.1109/VLSIT.2016.7573381","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573381","url":null,"abstract":"Following the previous study on Si:P [1], we also achieve ultralow contact resistivities (ρ<sub>c</sub>) of ~2×10<sup>-9</sup> Ω·cm<sup>2</sup> on Si<sub>0.3</sub>Ge<sub>0.7</sub>:B using the same Ti based pre-contact amorphization (PCAI) plus post-metal anneal (PMA) technique. Similar as on Si:P, low-energy PCAI provides the lowest ρ<sub>c</sub> on SiGe:B. By increasing the B concentration, the PMA temperature required on SiGe:B also matches with that on Si:P. A simple Ti based CMOS contact flow is thus proposed. Several B doping and activation methods on SiGe:B are also compared in this work.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123437346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 29
High-density user-programmable logic array based on adjacent integration of pure-CMOS crossbar antifuse into logic CMOS circuits 高密度用户可编程逻辑阵列,基于相邻集成的纯CMOS交叉防熔丝到逻辑CMOS电路
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573364
S. Yasuda, Masato Oda, M. Matsumoto, K. Tatsumura, K. Zaitsu, Y. Ho, M. Ono
{"title":"High-density user-programmable logic array based on adjacent integration of pure-CMOS crossbar antifuse into logic CMOS circuits","authors":"S. Yasuda, Masato Oda, M. Matsumoto, K. Tatsumura, K. Zaitsu, Y. Ho, M. Ono","doi":"10.1109/VLSIT.2016.7573364","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573364","url":null,"abstract":"Novel crossbar antifuse for high-density user programmable logic array (PLA) is presented. Circuit area reduction and routability increase of PLA are achieved by crossbar architecture based on pure-CMOS antifuse adjacently integrated into low-voltage and high-speed logic transistors. In addition, since our crossbar antifuse technique can be fabricated according to the standard design rule of advanced CMOS process, it is easy to implement our PLA as a user-customizable embedded logic in SoC. The logic density of our test chip in 65 nm process technology is 1835 lookup-tables (LUTs)/mm2, which is larger than any previous reports.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122646730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Demonstration of record SiGe transconductance and short-channel current drive in High-Ge-Content SiGe PMOS FinFETs with improved junction and scaled EOT 具有改进结和缩放EOT的高锗含量SiGe PMOS finfet中创纪录的SiGe跨导和短通道电流驱动的演示
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573370
P. Hashemi, K. Lee, T. Ando, K. Balakrishnan, J. Ott, S. Koswatta, S. Engelmann, Dae-gyu Park, V. Narayanan, R. Mo, E. Leobandung
{"title":"Demonstration of record SiGe transconductance and short-channel current drive in High-Ge-Content SiGe PMOS FinFETs with improved junction and scaled EOT","authors":"P. Hashemi, K. Lee, T. Ando, K. Balakrishnan, J. Ott, S. Koswatta, S. Engelmann, Dae-gyu Park, V. Narayanan, R. Mo, E. Leobandung","doi":"10.1109/VLSIT.2016.7573370","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573370","url":null,"abstract":"We demonstrate high-performance (HP) High-Ge-Content (HGC) SiGe pMOS FinFETs with scaled EOT and improved junction. For the first time, SiGe FinFET EOT scaling down to ~7Å has been achieved. In addition, improved junction and series resistance has been demonstrated for HGC SiGe, by a proper choice of spacer thickness and interface-layer as well as hot ion-implant (I/I), resulting in significant R<sub>on</sub> reduction down to 250 and 200Ω.μm, respectively. We report the highest “SiGe extrinsic g<sub>m</sub>” reported to date with g<sub>m, LIN</sub>=0.5mS/μm and g<sub>m, SAT</sub>=2.7/2.5mS/μm at V<sub>DD</sub>=1.0/0.5V, the highest HGC SiGe I<sub>on</sub>=0.45mA/μm at fixed HP I<sub>off</sub> =100nA/μm at V<sub>DD</sub>=0.5V and the highest pMOS FinFET performance reported to date at sub-35nm L<sub>G</sub>.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122742181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Intelligent mobility realized through VLSI 通过VLSI实现智能移动
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573358
T. Asami
{"title":"Intelligent mobility realized through VLSI","authors":"T. Asami","doi":"10.1109/VLSIT.2016.7573358","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573358","url":null,"abstract":"Since the first introduction of microprocessors in automobiles in the 1970's, the world has witnessed their dramatic growth as well as their contribution to all aspects of vehicle performance. As the global demand for personal mobility continues to grow, the automotive industry needs to accelerate the development of solutions to social issues such as environment, energy security, traffic accidents, and urban traffic congestion. To address these issues, Nissan seeks out the ultimate goal of “Zero Emission” and “Zero Fatalities” through vehicle electrification and vehicle intelligence. The electric vehicle is a symbol of electrification, where components are fully electrically-powered and controlled. Autonomous driving technologies, such as advanced sensing, dynamic driving context interpretation, vehicle maneuver planning and controls, exemplify vehicle intelligence. This paper provides an overview of the contribution of VLSIs (very-large-scale integration) to enhancing vehicle electrification and vehicle intelligence, as well as the perspectives for future mobility systems.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"135 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134004602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
InGaAs nanowire MOSFETs with ION = 555 µA/µm at IOFF = 100 nA/µm and VDD = 0.5 V InGaAs纳米线mosfet, IOFF = 100 nA/µm, VDD = 0.5 V, ION = 555µA/µm
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573418
C. Zota, Fredrik Lindelow, L. Wernersson, E. Lind
{"title":"InGaAs nanowire MOSFETs with ION = 555 µA/µm at IOFF = 100 nA/µm and VDD = 0.5 V","authors":"C. Zota, Fredrik Lindelow, L. Wernersson, E. Lind","doi":"10.1109/VLSIT.2016.7573418","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573418","url":null,"abstract":"We report on In<sub>0.85</sub>Ga<sub>0.15</sub>As nanowire MOSFETs (NWFETs) with record performance in several key VLSI metrics. These devices exhibit I<sub>ON</sub> = 555 μA/μm (at I<sub>OFF</sub> = 100 nA/μm and V<sub>DD</sub> = 0.5 V), I<sub>ON</sub> = 365 μA/μm (at I<sub>OFF</sub> = 10 nA/μm and V<sub>DD</sub> = 0.5 V) and a quality factor Q = g<sub>m</sub>/SS of 40, all of which are the highest reported for a III-V as well as silicon transistor. Furthermore, a highly scalable, self-aligned gate-last fabrication process is utilized, with a single nanowire as the channel. The devices use a 45° angle between the nanowire and the contacts, which allows for up to a 1.4 times longer gate length at a given pitch.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134484519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Advanced non-volatile embedded memory for a wide range of applications 先进的非易失性嵌入式存储器,适用于广泛的应用
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573365
S. Kimura
{"title":"Advanced non-volatile embedded memory for a wide range of applications","authors":"S. Kimura","doi":"10.1109/VLSIT.2016.7573365","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573365","url":null,"abstract":"Non-volatile memory is at the cutting-edge of technology for LSIs and is used in a wide variety of applications ranging from low-power IoT (Internet of Things) devices to high-performance ECUs (engine control units) for automobiles. Since there is currently no universal non-volatile memory, each chip should be equipped with a non-volatile embedded memory best fitted for its application. Fortunately, various kinds of non-volatile memory exist, including emerging memories.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133687852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Achieving Sub-ns switching of STT-MRAM for future embedded LLC applications through improvement of nucleation and propagation switching mechanisms 通过改进成核和传播切换机制,实现STT-MRAM在未来嵌入式LLC应用中的Sub-ns切换
2016 IEEE Symposium on VLSI Technology Pub Date : 2016-06-14 DOI: 10.1109/VLSIT.2016.7573362
G. Jan, L. Thomas, S. Le, Yuan-Jen Lee, Huanlong Liu, Jian Zhu, J. Iwata-Harms, Sahil J. Patel, R. Tong, S. Serrano-Guisan, D. Shen, R. He, J. Haq, J. Teng, V. Lam, R. Annapragada, Yu-Jen Wang, T. Zhong, T. Torng, P. Wang
{"title":"Achieving Sub-ns switching of STT-MRAM for future embedded LLC applications through improvement of nucleation and propagation switching mechanisms","authors":"G. Jan, L. Thomas, S. Le, Yuan-Jen Lee, Huanlong Liu, Jian Zhu, J. Iwata-Harms, Sahil J. Patel, R. Tong, S. Serrano-Guisan, D. Shen, R. He, J. Haq, J. Teng, V. Lam, R. Annapragada, Yu-Jen Wang, T. Zhong, T. Torng, P. Wang","doi":"10.1109/VLSIT.2016.7573362","DOIUrl":"https://doi.org/10.1109/VLSIT.2016.7573362","url":null,"abstract":"We present recent advances in writing speed of pSTT_MRAM which demonstrate its potential as a candidate for replacement of LCC cache for advanced technology nodes as well as applications where non-volatility may be needed. In this paper we explore the feasibility of sub-ns switching of devices and their characterization using comprehensive time resolved electrical measurement of the reversal mechanism. We show that the switching mechanism can be described as a simple nucleation followed by propagation model that can be characterized statistically. We further demonstrate that after optimization of the Magnetic Tunnel Junction (MTJ) stack, single devices can be switched reliably using write pulse length down to 750ps while preserving functionality and data retention @ 125°C. Results of the integration at array level on an 8MB test vehicle are also presented allowing full array writing using 3ns pulses without ECC and demonstrated data retention of 10 years (1ppm) at 125°C.","PeriodicalId":129300,"journal":{"name":"2016 IEEE Symposium on VLSI Technology","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121996220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 30
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