通过系统的RTN表征和从头计算,深入了解高k栅极介质中工艺诱导的预先存在陷阱和PBTI应力诱导的陷阱

Jiezhi Chen, Y. Nakasaki, Y. Mitani
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引用次数: 2

摘要

在这项工作中,为了全面了解已有陷阱和应力诱导陷阱的产生,通过恒定偏置随机电报噪声(cRTN)和瞬态RTN (tRTN)表征,比较研究了HfSiON和HfLaSiON非场效应管。随着La掺入,由于深阱密度降低,低频噪声被抑制,而浅阱密度增加,BTI降低。更重要的是,实验首次观察到PBTI应力会产生大量深部圈闭,而浅层圈闭同时部分消失。在第一性原理计算的基础上,讨论了高k栅极堆叠非场效应管中PBTI的潜在机制,并提出了一个新的模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep insight into process-induced pre-existing traps and PBTI stress-induced trap generations in high-k gate dielectrics through systematic RTN characterizations and ab initio calculations
In this work, aiming at comprehensive understandings on pre-existing traps and stress-induced trap generations, HfSiON and HfLaSiON nFETs are comparatively studied by using the constant bias random telegraph noise (cRTN) and the transient RTN (tRTN) characterizations. With La incorporation, low frequency noise is suppressed due to lower deep trap densities while BTI degrades due to shallow traps increasing. More importantly, it is experimentally observed for the first time that PBTI stress will generate deep traps dramatically while shallow traps partly lost simultaneously. Based on the first-principles calculations, underlying mechanisms are discussed and a new model is proposed for PBTI in high-k gate stack nFETs.
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