高密度用户可编程逻辑阵列,基于相邻集成的纯CMOS交叉防熔丝到逻辑CMOS电路

S. Yasuda, Masato Oda, M. Matsumoto, K. Tatsumura, K. Zaitsu, Y. Ho, M. Ono
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引用次数: 1

摘要

提出了一种适用于高密度用户可编程逻辑阵列(PLA)的新型交叉棒防熔丝。采用基于纯cmos反熔丝的横杆结构,将其邻接集成到低压高速逻辑晶体管中,实现了电路面积的缩小和可达性的提高。此外,由于我们的交叉棒防熔丝技术可以根据先进CMOS工艺的标准设计规则制造,因此很容易将我们的PLA作为用户可定制的嵌入式逻辑实现在SoC中。我们采用65nm制程技术的测试芯片的逻辑密度为1835查找表(LUTs)/mm2,这比以往任何报告都要大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-density user-programmable logic array based on adjacent integration of pure-CMOS crossbar antifuse into logic CMOS circuits
Novel crossbar antifuse for high-density user programmable logic array (PLA) is presented. Circuit area reduction and routability increase of PLA are achieved by crossbar architecture based on pure-CMOS antifuse adjacently integrated into low-voltage and high-speed logic transistors. In addition, since our crossbar antifuse technique can be fabricated according to the standard design rule of advanced CMOS process, it is easy to implement our PLA as a user-customizable embedded logic in SoC. The logic density of our test chip in 65 nm process technology is 1835 lookup-tables (LUTs)/mm2, which is larger than any previous reports.
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