{"title":"Fundamentals Of Wafer Fab Automation The Forth Generation CIM FA","authors":"T. Koike","doi":"10.1109/ISSM.1994.729415","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729415","url":null,"abstract":"The large scale wafer requires more precise process control, feedback/feed forward for the productivity than ever. CIM FA (Computer Integrated Manufacturing Factory Automation) will be a fundamental solution to future semiconductor manufacturing. In this paper, I would like to discuss about what CIM FA should be for semiconductor manufacturing, and would introduce CIM FA plant where we are now operating 200mm manufacturing.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132594818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An Efficient Resource Planning For Semiconductor Manufacturing Lines Using Precise Simulation","authors":"S. Nakamura","doi":"10.1109/ISSM.1994.729426","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729426","url":null,"abstract":"The large investment required for ASIC manufacturing lines makes it essential to minimize the turnaround time and work-in-process while improving machine utilization. For this purpose, we propose efficient planning method using lot capacity analysis models to estimate the rough numbers of each machine and discrete-event simulation that can reflect many details of actual lot processing and line operation. This paper describes how this can be used to optimize resources in the product mix with some special lot processing.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128726754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Environmental Awareness In Semiconductor Manufacturing","authors":"Y. Ishii","doi":"10.1109/ISSM.1994.729414","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729414","url":null,"abstract":"World current for sustainable development is requiring environmentally sound production processes and products. Semi-conductor industry is high tech one. However, it consumes larger amount of resources than other industries. It is hoped that the semi-conductor industries will consider this point and make efforts to improve it in the same competitive way as their products performances.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"2009 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125599194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Single-Wafer Processing And Real-Time Process Control For Semiconductor Integrated Circuit Manufacturing","authors":"A. Bowling","doi":"10.1109/ISSM.1994.729417","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729417","url":null,"abstract":"For 300 mm and larger diameter silicon wafer processing, it is clear that single-wafer processing will play a dominant role. In addition to current use of single-wafer processing for lithography, plasma etch, and metal deposition, recent research has shown that single-wafer processing will even displace most batch furnace processes and wafersurface preparation processes. In addition, the implementation of in-situ sensors will allow the use of real-time process control to improve process reproducibility and equipment utilization.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125005119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Constraint-Based Systems Approach To Line Yield Improvement","authors":"Viju S. Menon","doi":"10.1109/ISSM.1994.729444","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729444","url":null,"abstract":"This paper adopts a \"systems thinking\" approach, in confluence with \"theory of constraints\", to develop line yield improvement tools for semiconductor fabrication. Systems Thinking emphasizes the underlying structure driving line yield behavior, thus uncovering high leverage strategies for line yield. A Constraints approach helps to focus improvement efforts on those line yield problems having the most revenue impact. Thus, after identifying fundamental issues that contribute to line yield performance, this paper recommends key changes to management systems, structure, and policies, to achieve higher line yields in semiconductor fabrication.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132132206","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"CIM Systems In An Advanced Semiconductor Factory","authors":"K. Shibata","doi":"10.1109/ISSM.1994.729422","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729422","url":null,"abstract":"The policies of CIM systems development and delivery in an advanced semiconductor factory are described, establishing a methodology for efficient production of a variety of devices. The implementation of CIM systems is expected to enhance total productivity in process and device engineering technology, wafer fabrication technology, and equipment efficiency. A dispatcher has been developed, and is presently evaluating the performance of WIP lot movements using production-line data. Production-line analysis tools are introduced and successfully utilized in quantitative analysis. A statistical fine control system (SFINCS) is developed to carry out process parameter optimization for the following lot. An expert system for fail-bit discrimination is developed. Detailed, accurate, and rapid pattern discrimination of fail-bit data is achieved.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127375546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Yield Prediction Method Considering The Limit Of Sub-Micron Pattern Fabrication","authors":"N. Hattori, M. Ikeno, H. Nagata","doi":"10.1109/ISSM.1994.729443","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729443","url":null,"abstract":"Many random defects are caused by deposited particles during the manufacturing processes. Therefore, defect density and yield have been predicted from the information of particle characterization and the feature analysis of designed patterns to take effective measures for yield enhancement. The report gives the procedure of this prediction and discusses the parameters for the use in the critical fabrication size. Our parametric improvement provides an accurate prediction.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116454194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Cost And Throughput Of The Next Generation Semiconductor Production Equipments","authors":"T. Iwata","doi":"10.1109/ISSM.1994.729445","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729445","url":null,"abstract":"When we think about the cost and the throughput of the next generation semiconductor production quipment, first of all we should clarify the specification of the entire next generation semiconductor manufacturing line system, that is, manufacturing ability and amount of the investment. Next, we analyze this value and we obtain the cost and the throughput of the production equipments used in this line system. In this step, a needless function and excessive performance for the equipments are deleted. A proper target of the production equipment development can be clarified according to such procedures.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128567704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
D. Hanson, Hung-sheng Chen, D. Kao, J.K. Kibarian, K. Michaels
{"title":"Analysis Of The Controllability Of A Sub-Micron CMOS Process Using TCAD","authors":"D. Hanson, Hung-sheng Chen, D. Kao, J.K. Kibarian, K. Michaels","doi":"10.1109/ISSM.1994.729429","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729429","url":null,"abstract":"In this paper we describe the statistical simulation and SPICE model prediction of a 0.8um CMOS process. The simulation environment consisted of an integrated TCAD framework combining two dimensional process and device simulation with physically-based SPICE model extraction. In-line process tolerances were assigned, and Monte Carlo simulation was used to predict the variation of device performance and worst case SPICE model parameters. The device parameter distributions resulting from 100 Monte Carlo simulations were found on average to match the three sigma limites of the electrical database within 5% as shown in Table 1. Nominal BSIM models extracted deterministically with pdFab were found to match the typical results of a proprietary device model within 10%.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128425317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Development Of A Highly Efficient Fan Filter System For Clean Rooms","authors":"I. Honbori, Y. Kato, T. Kisakibaru","doi":"10.1109/ISSM.1994.729455","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729455","url":null,"abstract":"Recently in the semiconductor IC production, the investment and the running cost of a clean room air conditioning system have been increasing in proportion to enlarging the production scale. The above investment in it occupies 20% of it in the plant investment and the running cost reaches 45% cost of the plant running cost. These are in the considerable ratio of the IC manufacturing cost. Under the above situation, to reduce the investment and the running cost of it can make a great deal of profit as much as cost reductions of production equipments and others. To accomplish the above reductions of the clean room air conditioning system, the low cost and the highly efficient fan filter system has been developed by authors.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130053874","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}