基于TCAD的亚微米CMOS工艺可控性分析

D. Hanson, Hung-sheng Chen, D. Kao, J.K. Kibarian, K. Michaels
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引用次数: 9

摘要

本文描述了一种0.8um CMOS工艺的统计仿真和SPICE模型预测。仿真环境由一个集成的TCAD框架组成,该框架结合了二维过程和器件仿真以及基于物理的SPICE模型提取。分配了在线工艺公差,并使用蒙特卡罗模拟预测了器件性能和最坏情况下SPICE模型参数的变化。通过100次蒙特卡罗模拟得出的器件参数分布平均在5%以内与电气数据库的三个西格玛极限相匹配,如表1所示。使用pdFab确定提取的标称BSIM模型与专有器件模型的典型结果在10%以内匹配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis Of The Controllability Of A Sub-Micron CMOS Process Using TCAD
In this paper we describe the statistical simulation and SPICE model prediction of a 0.8um CMOS process. The simulation environment consisted of an integrated TCAD framework combining two dimensional process and device simulation with physically-based SPICE model extraction. In-line process tolerances were assigned, and Monte Carlo simulation was used to predict the variation of device performance and worst case SPICE model parameters. The device parameter distributions resulting from 100 Monte Carlo simulations were found on average to match the three sigma limites of the electrical database within 5% as shown in Table 1. Nominal BSIM models extracted deterministically with pdFab were found to match the typical results of a proprietary device model within 10%.
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