发布求助
文献互助 智能选刊 最新文献

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM最新文献

筛选
英文 中文
Issues Of Wet Cleaning In ULSI Process ULSI工艺中湿法清洗的问题
International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI: 10.1109/ISSM.1994.729430
T. Ajioka, Y. Mizokami
{"title":"Issues Of Wet Cleaning In ULSI Process","authors":"T. Ajioka, Y. Mizokami","doi":"10.1109/ISSM.1994.729430","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729430","url":null,"abstract":"Wet cleaning for actual LSI processes is discussed. Particle elimination efficiency is limited by suppression of device degradation and cleaning is invalid for the particles generated during etching and film formation. Particle reduction depends on particle characteristics, i.e. the sticking force and the chemical structure of the particles. Metallic contamination on wafers, dependent on a kind of solutions and the concentration in a solution, degrades TDDB characteristics and recombination lifetime. Although the lifetime degradation is a serious problem for ULSI, the damage by etching and by ion implantation causes the lifetime lowering rather than metallic contamination.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131821016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Eouipment Modeling: A Tool To Cost Reduction 设备建模:降低成本的工具
International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI: 10.1109/ISSM.1994.729437
N. S. Alvi
{"title":"Eouipment Modeling: A Tool To Cost Reduction","authors":"N. S. Alvi","doi":"10.1109/ISSM.1994.729437","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729437","url":null,"abstract":"Complexities in manufacturing and needs for cost containment have spawned a drive to develop accurate and efficient modeling techniques. These range from addressing market scenarios and factory performance at the strategic level to the performance of individual equipment at the tactical level, such as throughput, clustering and reliability. The modeling of individual equipment and process is an important link in the overall drive to comprehend and reduce cost factors at the factory level. This paper describes the application of analytical and computational modeling techniques used to optimize process and equipment design of furnace, chemical vapor deposition (CVD), rapid thermal processing (RTP), and plasma etch and deposition equipment.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114799041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Silicon Technology Roadmap To 2010 硅技术路线图到2010年
International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI: 10.1109/ISSM.1994.729413
T. Seidel
{"title":"Silicon Technology Roadmap To 2010","authors":"T. Seidel","doi":"10.1109/ISSM.1994.729413","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729413","url":null,"abstract":"An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127286394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automated In-line Monitoring Of Chemical Assay In Wafer Cleaning Solution 晶圆清洗溶液中化学分析的自动在线监测
International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1900-01-01 DOI: 10.1109/ISSM.1994.729453
S. Takaiwa, T. Funabashi, A. Yoshii, T. Iwata
{"title":"Automated In-line Monitoring Of Chemical Assay In Wafer Cleaning Solution","authors":"S. Takaiwa, T. Funabashi, A. Yoshii, T. Iwata","doi":"10.1109/ISSM.1994.729453","DOIUrl":"https://doi.org/10.1109/ISSM.1994.729453","url":null,"abstract":"The continuous monitoring equipment for the chemical assay of these cleaning solution has been developed. These assay are determined by the electrochemical sensing probes such called as ion selective electrodes. With this method, it is able to measure the concentration of components in the solution by the sensitivity of 0. 1 -1 g/L.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133044857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信