{"title":"Silicon Technology Roadmap To 2010","authors":"T. Seidel","doi":"10.1109/ISSM.1994.729413","DOIUrl":null,"url":null,"abstract":"An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1994.729413","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.