硅技术路线图到2010年

International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM Pub Date : 1994-06-21 DOI:10.1109/ISSM.1994.729413

T. Seidel

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摘要

对2010年的硅技术路线图进行了分析。合作(本次会议的主题)是成功实现路线图目标的基础。成本上升已被全球公认为共同的敌人，关键的合作机会存在于光刻、晶圆污染和环境技术领域。这些机会是在不利的贸易政策背景下发展起来的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Silicon Technology Roadmap To 2010

An analysis of the Silicon Technology Roadmap out to 2010 is presented. Partnering (this conference theme) is fundamental to the success of meeting the Roadmap goals. Escalating cost has been globally identified as a common enemy, key partnership opportunities exist in the areas of lithography, wafer contamination and environmental technologies. These opportunities are being developed against a background of adverse trade policies.

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International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM

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