Yield Prediction Method Considering The Limit Of Sub-Micron Pattern Fabrication

Many random defects are caused by deposited particles during the manufacturing processes. Therefore, defect density and yield have been predicted from the information of particle characterization and the feature analysis of designed patterns to take effective measures for yield enhancement. The report gives the procedure of this prediction and discusses the parameters for the use in the critical fabrication size. Our parametric improvement provides an accurate prediction.