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2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)最新文献

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Thermal Stability of DETF MEMS Resonators: Numerical Modelling and Experimental Validation DETF MEMS谐振器的热稳定性:数值模拟与实验验证
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056338
V. Zega, A. Opreni, G. Mussi, Hyun-Keun Kwon, G. Vukasin, G. Gattere, G. Langfelder, A. Frangi, T. Kenny
{"title":"Thermal Stability of DETF MEMS Resonators: Numerical Modelling and Experimental Validation","authors":"V. Zega, A. Opreni, G. Mussi, Hyun-Keun Kwon, G. Vukasin, G. Gattere, G. Langfelder, A. Frangi, T. Kenny","doi":"10.1109/MEMS46641.2020.9056338","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056338","url":null,"abstract":"The design, fabrication and experimental validation of two MicroElectroMechanical Systems (MEMS) Double-Ended Tuning-Fork (DETF) resonators that exhibit an intrinsic sub-350 ppm thermal stability in the temperature range [5°C–85°C] are reported. A strategy for the optimization of the design of MEMS resonators that exhibit high thermal stability and high quality factor is also provided and a good agreement with experimental data is achieved. The main advantage of the proposed strategy is that it does not require any experimental calibration of the model parameters and can be in principle applied to different kind of resonators, thus representing a powerful tool for the apriori design of thermally stable MEMS resonators with high quality factors.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"20 1","pages":"1207-1210"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81968246","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
High-Speed and Stepping MEMS Rotary Actuator for Multimodal, 360° Side-Viewing Endoscopic Probes 高速和步进MEMS旋转致动器多模态，360°侧视内窥镜探头
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056226
S. Jayhooni, B. Assadsangabi, G. Hohert, P. Lane, H. Zeng, K. Takahata
{"title":"High-Speed and Stepping MEMS Rotary Actuator for Multimodal, 360° Side-Viewing Endoscopic Probes","authors":"S. Jayhooni, B. Assadsangabi, G. Hohert, P. Lane, H. Zeng, K. Takahata","doi":"10.1109/MEMS46641.2020.9056226","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056226","url":null,"abstract":"This paper reports, for the first time, a MEMS rotary actuator that enables side-viewing microendoscopic probes with different modalities for luminal tissue analysis. The developed tubular-form micro rotary actuator offers both high-speed and stepping motions that are compatible with the use for optical coherence tomography (OCT) and Raman spectroscopy, respectively. The actuator, improved from its preceding designs, shows up to 125× higher revolution speeds per power while enabling arbitrary angle-resolved stepping rotations in a ∼50% thinner body, with significantly reduced heating effect for biologically safe operation in vivo. Preliminary testing of the OCT endoscopic probe integrated with the developed rotary actuator/scanner successfully demonstrates real-time 360° imaging of live human skin tissue.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"75 1","pages":"376-379"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78650549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
On-Demand Photothermal Bar-Chart Microfluidic Platform Using On-Chip Nanomaterial-Mediated Photothermal Effect as the Microfluidic Driving Force 基于片上纳米材料介导的光热效应作为微流控驱动力的按需光热条形图微流控平台
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056141
Wan Zhou, Guanglei Fu, Xiujun Li
{"title":"On-Demand Photothermal Bar-Chart Microfluidic Platform Using On-Chip Nanomaterial-Mediated Photothermal Effect as the Microfluidic Driving Force","authors":"Wan Zhou, Guanglei Fu, Xiujun Li","doi":"10.1109/MEMS46641.2020.9056141","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056141","url":null,"abstract":"A new type of microfluidic platforms, photothermal bar-chart chip (PT-Chip), has been developed using the on-chip nanomaterial-mediated photothermal effect as the novel tunable microfluidic driving force to drive ink bar charts in a visual quantitative readout fashion. This is the first time to exploit the nanomaterial-mediated photothermal effect for microfluidic pumping and also serves as the first report of the photothermal bar-chart microfluidic platform with wide microfluidic applications, especially for visual quantitative point-of-care detection.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"125-128"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83682472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Planar Single-Actuator Bi-Stable Mechanical Latch as an Electrical Switch 平面单致动器双稳定机械锁存器作为电气开关
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056413
Yang Bu, Yue Jiang, Saeko Kawano, B. S. T. Tam, Sheng Ni, Liying Lin, O. Tabata, T. Tsuchiya, X. Wang, M. Wong
{"title":"A Planar Single-Actuator Bi-Stable Mechanical Latch as an Electrical Switch","authors":"Yang Bu, Yue Jiang, Saeko Kawano, B. S. T. Tam, Sheng Ni, Liying Lin, O. Tabata, T. Tsuchiya, X. Wang, M. Wong","doi":"10.1109/MEMS46641.2020.9056413","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056413","url":null,"abstract":"A micro-fabricated planar bi-stable mechanical latch is demonstrated and presently reported. The compact size of the bi-stable mechanism is achieved by enclosing an anchored latch groove in the center of other movable structures. Driven using a single actuator, the device can be switched mechanically between two stable states by applying respective setting and resetting voltage of 10.3 V and 9.5 V. Exhibiting good durability and promising potential for applications demanding micro-switches, the device was demonstrated as an electrical switch to control a light-emitting diode.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"42 1","pages":"493-496"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91221825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Rapid Prototyping of Microactuators by Integrating 3D Printed Polymeric Structures with NiTi Thin Film 集成3D打印聚合物结构与NiTi薄膜的微致动器快速成型
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056231
C. Vélez, Sukjun Kim, M. Babaei, D. Patel, C. Knick, Gabriel L. Smith, S. Bergbreiter
{"title":"Rapid Prototyping of Microactuators by Integrating 3D Printed Polymeric Structures with NiTi Thin Film","authors":"C. Vélez, Sukjun Kim, M. Babaei, D. Patel, C. Knick, Gabriel L. Smith, S. Bergbreiter","doi":"10.1109/MEMS46641.2020.9056231","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056231","url":null,"abstract":"This work demonstrates the first sputtered thin-film nickel-titanium (NiTi) shape-memory alloy (SMA) actuators combined with direct 3D printing of polymeric structures. Resulting actuators are fast to prototype, reliable and stable (up to 5000 cycles), and can utilize complex geometries challenging to achieve with conventional MEMS microfabrication. The actuator design uses 3D printed polymer as the passive layer in unimorph actuators, adding significant versatility to the actuator design. An actuator designed for high force-displacement was fabricated with a $15 mu mathrm{m}$ thick polymer layer and characterized by applying currents up to 18 ma (7.3 mW, producing ∼156°C) resulting in a maximum displacement of $3.3 mu mathrm{m}$ and ∼0.9 mN blocking force. Dynamic operation with falling/rising times of 20.1 ms/9.8 ms and 33.5 Hz maximum operation frequency was also demonstrated.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"34 1","pages":"893-896"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88354179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Design and Implementation of a Novel Skull Vibration Sensing Module for Bone Conduction Microphone 一种新型骨传导麦克风颅骨振动传感模块的设计与实现
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056312
Bo-Cheng You, Sung-Cheng Lo, Chun-Kai Chan, Hsien-Lung Ho, Shih-Chia Chiu, Guan-Hong Hsieh, W. Fang
{"title":"Design and Implementation of a Novel Skull Vibration Sensing Module for Bone Conduction Microphone","authors":"Bo-Cheng You, Sung-Cheng Lo, Chun-Kai Chan, Hsien-Lung Ho, Shih-Chia Chiu, Guan-Hong Hsieh, W. Fang","doi":"10.1109/MEMS46641.2020.9056312","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056312","url":null,"abstract":"This study presents a packaged MEMS acoustic or air pressure sensing module (Fig. 1) to detect the skull vibration for bone conduction microphone (BCM) application. The proposed microphone design has two merits: (1) the packaged module (Fig. 1) enable the skull vibration detection using the MEMS sensor; (2) no sound port is required to remove the environmental and wind noise and to avoid the damage from dust and water (Fig. 1a). The device with the dimensions of $3.5times 2.65times 1.48 text{mm}^{3}$ is implemented using the packaging and assembly of existing MEMS sensor with polymer diaphragm and metal proof-mass. Measurements show the device has a sensitivity of −39.1dB/g, $text{THD} < 0.22 %$ at 1kHz, and ±5dB bandwidth for 100Hz∼6.7kHz. Frequency responses of different samples show good repeatability.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"4 1","pages":"118-121"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89235155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Self-Recovering 3-Dimensional Micro Pore Structure Pressure Sensor Using Shape Memory Polymer 基于形状记忆聚合物的自恢复三维微孔结构压力传感器
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056168
Byunggeon Park, Young Jung, M. Shin, J. Ko, Hanchul Cho
{"title":"Self-Recovering 3-Dimensional Micro Pore Structure Pressure Sensor Using Shape Memory Polymer","authors":"Byunggeon Park, Young Jung, M. Shin, J. Ko, Hanchul Cho","doi":"10.1109/MEMS46641.2020.9056168","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056168","url":null,"abstract":"Shape memory polymer (SMP) is a polymer based on PU that has the property of restoring to its original shape at a specific temperature like a shape memory alloy. This ability could improve durability of sensors in cyclic loading. We fabricate a porous structured sensor having a self-recovery ability. This sensor shows good durability and sensitivity than other polyurethane porous structure. Also, the developed sensor is rapidly restored in 30 seconds in a 70 °C oven. We propose a self-recovering capacitive pressure sensor which has excellent durability. Furthermore, it works in the wide pressure range (∼400kPa) with good linearity.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"71 1","pages":"685-688"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91227717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Investigating Long-Term Stability of Wide Bandwidth Surface Acoustic Waves Gyroscopes Using a Monolithically Integrated Micro-Oven 用单片集成微烤箱研究宽带表面声波陀螺仪的长期稳定性
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056180
A. Mahmoud, T. Mukherjee, G. Piazza
{"title":"Investigating Long-Term Stability of Wide Bandwidth Surface Acoustic Waves Gyroscopes Using a Monolithically Integrated Micro-Oven","authors":"A. Mahmoud, T. Mukherjee, G. Piazza","doi":"10.1109/MEMS46641.2020.9056180","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056180","url":null,"abstract":"This paper is the first to investigate the long-term stability of Surface Acoustic Wave Gyroscopes (SAWG) using an ovenized control system. Monolithic integration of a MEMS heater adjacent to SAW devices on Lithium Niobate over insulator substrate (LNOI) tightly couples frequency-based temperature detection with heating for temperature and frequency stabilization. This first prototype demonstrates the ability to minimize the temperature variations of the SAWG to below $pm 10 mumathrm{K}$ and stabilize the SAWG resonance frequency to ±0.2 ppm. This approach thus eliminates the thermal drift in a SAWG and enables the development of a new generation of MEMS-based gyroscopes with long-term stability.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"33 1","pages":"252-254"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85635607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Subcellular Imaging During Single Cell Mechanical Characterization 单细胞力学表征过程中的亚细胞成像
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056362
Deniz Pekin, G. Perret, Quentin Rezard, J. Gerbedoen, S. Meignan, D. Collard, Chann Lagadec, M. Tarhan
{"title":"Subcellular Imaging During Single Cell Mechanical Characterization","authors":"Deniz Pekin, G. Perret, Quentin Rezard, J. Gerbedoen, S. Meignan, D. Collard, Chann Lagadec, M. Tarhan","doi":"10.1109/MEMS46641.2020.9056362","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056362","url":null,"abstract":"We report a method for combining confocal microscopy with single-cell mechanical characterization. This method allows investigating the effect of subcellular deformation (e.g. membranes, cytoplasm, cytoskeleton and organelles as endoplasmic reticulum, mitochondria, and nucleus) on cell mechanical properties (e.g. stiffness and viscosity). Such a method is essential to choose biologically relevant mechanical properties of malignant cells as diagnostic cancer biomarkers. Using MEMS tweezers, we captured live single cancer cells and performed subcellular imaging during compression assays for mechanical measurements to obtain the deformation-dependent cell properties.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"62-65"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80708337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Monolithic Integration of Plasmonic Meta-Material Absorber with CMOS-MEMs Infrared Sensor for Responsivity Enhancement and Human Detection Application 等离子体超材料吸收器与CMOS-MEMs红外传感器的集成，用于提高响应性和人体检测应用
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056382
Pen-Sheng Lin, Ting-Wei Shen, Kai-Chieh Chang, W. Fang
{"title":"Monolithic Integration of Plasmonic Meta-Material Absorber with CMOS-MEMs Infrared Sensor for Responsivity Enhancement and Human Detection Application","authors":"Pen-Sheng Lin, Ting-Wei Shen, Kai-Chieh Chang, W. Fang","doi":"10.1109/MEMS46641.2020.9056382","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056382","url":null,"abstract":"This study monolithically integrates a metal-insulator-metal-based (MIM) plasmonic metamaterial absorber (PMA) with a thermoelectric (TE) infrared (IR) sensor using standard TSMC CMOS platform. The proposed design extends the strip-via releasing hole structure in [1] to further integrate MIM absorber with TE IR sensor. Such design exhibits three merits: (1) the line width requirement of MIM absorber is achieved by CMOS process, (2) the absorption peaks of MIM absorbers can be modulated by pattern designs in the epsilon-near-pole region, and (3) the MIM absorbers can be designed to broaden the absorption spectrum of IR sensor. In application, the absorption spectrum of IR sensor is designed within $8-14mu mathrm{m}$ in this study for human detection application. Measurement result demonstrates the integration of MIM absorber and IR sensor can achieve 21% responsivity improvement and the measured absorption spectrum matches with simulation.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"58 1","pages":"157-160"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86798429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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