基于形状记忆聚合物的自恢复三维微孔结构压力传感器

2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI:10.1109/MEMS46641.2020.9056168

Byunggeon Park, Young Jung, M. Shin, J. Ko, Hanchul Cho

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引用次数: 3

摘要

形状记忆聚合物(SMP)是一种以PU为基础的聚合物，具有像形状记忆合金一样在特定温度下恢复其原始形状的特性。这种能力可以提高传感器在循环载荷下的耐久性。我们制造了一种具有自恢复能力的多孔结构传感器。与其他聚氨酯多孔结构相比，该传感器具有良好的耐久性和灵敏度。此外，开发的传感器在70°C的烤箱中在30秒内迅速恢复。我们提出了一种具有良好耐用性的自恢复电容式压力传感器。此外，它工作在宽的压力范围(~ 400kPa)，线性良好。

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Self-Recovering 3-Dimensional Micro Pore Structure Pressure Sensor Using Shape Memory Polymer

Shape memory polymer (SMP) is a polymer based on PU that has the property of restoring to its original shape at a specific temperature like a shape memory alloy. This ability could improve durability of sensors in cyclic loading. We fabricate a porous structured sensor having a self-recovery ability. This sensor shows good durability and sensitivity than other polyurethane porous structure. Also, the developed sensor is rapidly restored in 30 seconds in a 70 °C oven. We propose a self-recovering capacitive pressure sensor which has excellent durability. Furthermore, it works in the wide pressure range (∼400kPa) with good linearity.

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2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)

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