2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)最新文献_第7页

The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package 晶圆级芯片封装中焊料球剪切特性的实验与数值研究

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490737

Ye Zhang, Yangjian Xu, Y. Liu, A. Schoenberg

引用次数: 5

Direct chip powering and enhancement of proximity communication through Anisotropic Conductive adhesive chip-to-chip bonding 直接芯片供电和通过各向异性导电胶粘剂芯片间键合增强近距离通信

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490948

Jing Shi, D. Popovic, N. Nettleton, T. Sze, D. Douglas, H. Thacker, J. Cunningham, K. Furuta, R. Kojima, Koichi Hirose, Kuopin Hwang

{"title":"Direct chip powering and enhancement of proximity communication through Anisotropic Conductive adhesive chip-to-chip bonding","authors":"Jing Shi, D. Popovic, N. Nettleton, T. Sze, D. Douglas, H. Thacker, J. Cunningham, K. Furuta, R. Kojima, Koichi Hirose, Kuopin Hwang","doi":"10.1109/ECTC.2010.5490948","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490948","url":null,"abstract":"Proximity communication (PxC) technology has attracted great attention in recent years for its potential in low power, high bandwidth multi-chip module applications. In our previously demonstrated PxC MCM package, a 3-chip sub-assembly with two Active chips communicated through a Bridge chip and was flip-chip bonded to the substrate. The Bridge and Active chips overlap, and are face-to face bonded with silicone-based adhesive. The low pin count Bridge chip (face-up) relied on the bonded Au wire to deliver power and low speed I/Os. The parasitic inductance of the bondwires limited bandwidth on the Bridge, which motivated an alternative way to power the face-up Bridge chip. In this paper, we report chip-to-chip bonding using Anisotropic Conductive Film (ACF) as the dielectric adhesive between PxC channels. ACF provided direct vertical conductive path to power the Bridge chip. In addition, the introduction of conductive particles could increase the effective dielectric constant of the adhesive which benefits capacitively- signal coupling for proximity communications. The bonding experiment was carried out using a two-stage alignment and bonding/cure process at Sony Chemical & Information Device Corporation. Physical characterizations such as SAT, SEM, EDX were carried out to investigate bond line, alignment and quality of the adhesive interfaces. The effect of the floating metallic particles inside the ACF material on the local capacitive channels was simulated using a commercial FEM solver Q3D Extractor from ANSYS. We also tested conductive channel continuity through boundary scan-chain test of the Island chips. The initial results indicates that ACF sandwiched between two chips formed a uniform, void free bondline.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"293 1‐2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113966900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Methodology for predicting C4 non-wets during the chip attach process 在贴片过程中预测C4非湿性的方法

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490842

V. D. Khanna, S. M. Sri-Jayantha

引用次数: 6

Fabrication and characterization of embedded active and passive device for wireless application 用于无线应用的嵌入式有源和无源设备的制造和特性

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490663

Se-Hoon Park, Jongin Ryu, J. C. Kim, N. Kang, Jong Chul Park, Young-Ho Kim

{"title":"Fabrication and characterization of embedded active and passive device for wireless application","authors":"Se-Hoon Park, Jongin Ryu, J. C. Kim, N. Kang, Jong Chul Park, Young-Ho Kim","doi":"10.1109/ECTC.2010.5490663","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490663","url":null,"abstract":"In this study, the research of embedded active and passive package is carried out for miniaturized wireless module. We fabricated very small RF module which one bare chip (0.3mm × 0.5mm, SPDT switch IC) and three 0603(0.6mm × 0.3mm, MLCC) passive devices were buried into within 1.85mm × 1.5mm substrate. Used materials were compatible with PCB process such as polymer laminating, dry film patterning, electroless-electrolytic copper plating and atmospheric plasma treatment. We studied low pressure bonding process using rheology dependence of polymer on temperature to prevent fracture or crack from embedding chips into PCB. The embedded chip and passives were electrically interconnected by small laser via(30µm) and Cu pattern plating process after atmospheric pressure plasma treatment, which revealed an effect on filling of micro via and shape of fine pattern. The interconnection between chip pad and Cu were evaluated by SEM image, which shows Cu pattern of PCB and pad of passive was interconnected without intermetallic formation. However, intermetallic, Cu-Sn-Ni, formed between passive electrode and plated Cu layer, and molten Sn is segregated along the wall of via hole after reflow. DSC (Differenntial Scanning Calorimetry) analysis was employed to calculate and optimize the amount of curing. Polymer showed maximum 90° peel strength (~0.7kgf/cm) with Cu pattern when Cu is plated on polymer after pre-curing was 80~90% completed. The RF characterization of embedded chip PCB was evaluated by measuring s-parameters (S11; return loss and S21; insertion loss). Return loss was below 20dB up to 4GHz. As a results, the embedded chip module is able to be applied for 2~5 GHz frequency application (Bluetooth and WiFi) with small size and good performance.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131552904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer 基于TGV(玻璃通孔)的三维薄膜中间体:硅中间体的替代品

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490887

M. Töpper, I. Ndip, R. Erxleben, L. Brusberg, N. Nissen, H. Schröder, H. Yamamoto, Guido Todt, H. Reichl

{"title":"3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer","authors":"M. Töpper, I. Ndip, R. Erxleben, L. Brusberg, N. Nissen, H. Schröder, H. Yamamoto, Guido Todt, H. Reichl","doi":"10.1109/ECTC.2010.5490887","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490887","url":null,"abstract":"Interposers for SiP will become more and more important for advanced electronic systems. But through substrate vias are essential for the 3-D integration. Being a standard for laminate based materials this is much more complex for Si-wafers: High speed etching has to be combined with complex electrical isolation, diffusion barriers and void-free Cu-filling. Without doubt this can be solved in lab-scale but for high production scale cost is a tremendous barrier. Glass wafers with W-plugs have been intensively investigated in this paper. A new acronym has been posted to high-light this technology: TGV for Through Glass Vias. The results of modeling and simulation of TGV at RF/Microwave frequencies showed a very good compromise between wafer thickness, TGV-shape and via diameter for vertical metal plugs with 100 μm diameters in 500 μm thick glass wafer still very stable for thin film wafer processing without costly temporary wafer bonding processes. Therefore the HermeS® from Schott was chosen as the basis for a prototype of a bidirectional 4 × 10 Gbps electro-optical transceiver module. Thin film RDL and bumping of these wafers was possible without any modifications to Si-wafer. First thermal cycles showed very promising results for the reliability of this concept.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131612461","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 111

Realization of high spatial color uniformity for white light-emitting diodes by remote hemispherical YAG: Ce phosphor film 利用远端半球形YAG: Ce荧光粉薄膜实现白光二极管高空间色彩均匀性

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490747

Zongyuan Liu, Kai Wang, Xiaobing Luo, Sheng Liu

引用次数: 4

Inkjet-printed system-on-paper/polymer “green” RFID and wireless sensors 喷墨打印纸上系统/聚合物“绿色”RFID和无线传感器

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490784

M. Tentzeris, R. Vyas, V. Lakafosis, A. Traille, A. Rida, G. Shaker

{"title":"Inkjet-printed system-on-paper/polymer “green” RFID and wireless sensors","authors":"M. Tentzeris, R. Vyas, V. Lakafosis, A. Traille, A. Rida, G. Shaker","doi":"10.1109/ECTC.2010.5490784","DOIUrl":"https://doi.org/10.1109/ECTC.2010.5490784","url":null,"abstract":"In this talk, inkjet-printed flexible antennas, RF electronics and sensors fabricated on paper and other polymer (e.g. LCP) substrates are introduced as a system-level solution for ultra-low-cost mass production of UHF Radio Frequency Identification (RFID) Tags and Wireless Sensor Nodes (WSN) in an approach that could be easily extended to other microwave and wireless applications. A compact inkjet-printed UHF “passive-RFID” antenna using the classic T-match approach and designed to match IC's complex impedance, is presented as a demonstrating prototype for this technology. In addition, the authors briefly touch up the state-of-the-art area of fully-integrated wireless sensor modules on paper and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of a 3D multilayer paper-based RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future. Plus, the authors present benchmarking results for various scavenging approaches involving RF, kinetic and thermal energy. Various challenges of packaging, passives, antennas, sensors and power sources integration are investigated in terms of ruggedness, reliability and flexing performance for space, automotive, \"smart-skin\" and wearable applications. This is the first time a complete 3D \"green\" system-on-paper including vertical interconnects and silver epoxy for the attachment of IC's will be presented for operability in frequencies in excess of 900 MHz.","PeriodicalId":429629,"journal":{"name":"2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134119985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Flip-chip integrated silicon photonic bridge chips for sub-picojoule per bit optical links 用于每比特亚皮焦耳光链路的倒装集成硅光子桥芯片

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490965

H. Thacker, Ying Luo, Jing Shi, I. Shubin, J. Lexau, Xuezhe Zheng, Guoliang Li, Jin Yao, Joannes M. Costa, T. Pinguet, A. Mekis, P. Dong, S. Liao, D. Feng, M. Asghari, R. Ho, K. Raj, James G. Mitchell, A. Krishnamoorthy, J. Cunningham

引用次数: 41

Influence of bonding atmosphere on low-temperature wafer bonding 键合气氛对低温晶圆键合的影响

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490936

Yinghui Wang, T. Suga

引用次数: 2

Improvement of the solder joint strength in a SAC 305 solder ball to a ENIG substrate using LF hydrogen radical treatment 用LF氢自由基处理提高ENIG衬底的SAC 305焊点强度

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Pub Date : 2010-06-01 DOI: 10.5781/KWJS.2011.29.1.099

Seung-Jae Jo, Ah-Reum Lee, C. Kang

引用次数: 3