Effect of temperature on transition in failure modes for high speed impact test of solder joint and comparison with board level drop test

Abstract

An effort has been made in this study to evaluate the characteristics of solder joint failure by using a new high speed impact tester. Here, a more thorough understanding of the solder joint behavior is examined by characterizing the behavior with respect to varying temperature and impact profiles. This is done in an attempt to address solder joint failures in actual product that may be under operating temperatures and environments. Comparison between the high speed pendulum impact test and drop test was primarily made by evaluating the failure modes from these two tests. Energy absorbed by the solder in a single impact has been used to predict the reliability in a board level test. Also the effect of temperature on the reliability of solder interconnects and on the strain rate induced in the PCB during a drop test has been studied.