2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - 最新文献

Extending lower-cost packaging technology into next generation signaling: Techniques and considerations

Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490809 M. Doyle, J. Bartley, R. Ericson, M. Bailey, P. Germann, G. Zettles

Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconnects

Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490731 D. Malta, C. Gregory, D. Temple, T. Knutson, Chen Wang, T. Richardson, Yun Zhang, R. Rhoades

Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator

Pub Date : 2010-06-01 DOI: 10.1109/ECTC.2010.5490754 A. Yu, C. Premachandran, R. Nagarajan, C.W. Kyoung, Lam Quynh Trang, Rakesh Kumar, L. Lim, J. H. Han, Yap Guan Jie, P. Damaruganath

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