2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)最新文献_第9页

Meeting the heat removal requirements of 'tiled' compliant wafer level packages 满足“平铺”符合晶圆级封装的散热要求

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853164

C. Patel, S. Agraharam, K. Martin, J.D. Meindll

引用次数: 1

Packaging-compatible microtransformers on a silicon substrate 硅衬底上的封装兼容微变压器

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853149

J.Y. Park, H. K. Hong, J. Bu

引用次数: 1

Automation manufacturing systems technology for opto-electronic device packaging 光电器件封装自动化制造系统技术

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853108

Soon Jang

{"title":"Automation manufacturing systems technology for opto-electronic device packaging","authors":"Soon Jang","doi":"10.1109/ECTC.2000.853108","DOIUrl":"https://doi.org/10.1109/ECTC.2000.853108","url":null,"abstract":"In an effort to provide next-generation breakthroughs in photonics device manufacturing cost reduction and yield improvement, several new automation technologies have been developed and tested. Currently there are various fiber pigtailing assembly techniques successfully used in the industry including, epoxy, solder, mechanical fixture, and laser welding-the latter being the attachment technique most conducive to automation. While there have been substantial advancements at the optical sub-module level to address the low cost, high volume production issues, no well established device-handling strategy exists that can be deployed along the various phases of the manufacturing line. In this paper significant advancements in the areas of parts-handling, assembly automation, sub-micron weld-shift control, and automated post-weld fiber adjustment capabilities will be covered, along with examples of currently achievable device assembly processes. This multi-dimensioned device manufacturing automation strategy is based on some typical device designs and corresponding assembly and qualification processes currently used in the photonics device industry.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126561243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 51

Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability 倒装芯片组件中无流下填料的粘附特性及其与可靠性的相关性

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853173

Jicun Lu, B. Smith, D. Baldwin

引用次数: 5

CSP assembly reliability and effects of underfill and double-sided population 聚光聚光组件的可靠性及其对下填料和双面人口的影响

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853183

R. Ghaffarian

引用次数: 13

A low-cost and high-density RF multi-chip module transceiver for 1.8-GHz personal communication service 一种用于1.8 ghz个人通信服务的低成本高密度射频多芯片模块收发器

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853146

Woonghwan Ryu, Jonghoon J. Kim, Namhoon Kim, Hyungsoo Kim, Seungyoung Ahn, Sungil Kim, H. Song, Seungho Lee, Joungho Kim

{"title":"A low-cost and high-density RF multi-chip module transceiver for 1.8-GHz personal communication service","authors":"Woonghwan Ryu, Jonghoon J. Kim, Namhoon Kim, Hyungsoo Kim, Seungyoung Ahn, Sungil Kim, H. Song, Seungho Lee, Joungho Kim","doi":"10.1109/ECTC.2000.853146","DOIUrl":"https://doi.org/10.1109/ECTC.2000.853146","url":null,"abstract":"The explosion of global mobile telephone market has resulted in strong need for wide range and variety of packaging technologies in order to supply personal phones with enhanced product miniaturization, cost reduction, and good electrical performance. In that regard, Multi-Chip Module (MCM) is inevitably the one of the choice for the packaging of the mobile telephone. In this paper, we introduce an RF MCM-L transceiver module packaged by BGA for a 1.8-GHz personal communication service (PCS). We have focused most of our effort on low-cost and high-density design for the module. Basically, the low cost design is achieved using MCM-L substrate. The miniaturization of the transceiver was accomplished using optimally unified decoupling capacitors, thin MCM-L substrate and bare-chip mount technology. The second level package type of the RF MCM-L transceiver is ball grid array (BGA) with the ball size of 400 /spl mu/m. HP ADS and Maxwell software are used for the circuit and the interconnection simulation, and HP 8595E-spectrum analyzer is used for the RF measurement. The total area of the RF MCM transceiver is only 2.25 cm/sup 2/ which is reduced by 37.5% compared to the hybrid package type. The receiver of the RF MCM transceiver has exhibited typical 8 dB gain and 2.5 dB noise figure (NF). 1-dB saturation point is over -9 dBm. The transmitter of the RF MCM transceiver has had shown the typical gain of 25 dB. The power consumption of the receiver and the transmitter are 180 mW and 416 mW, respectively.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130481621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Studies on a reflowable underfill for flip chip application 倒装芯片用可回流底填料的研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853171

Tie Wang, C. Lum, J. Kee, T. H. Chew, P. Miao, L. Foo, C. Lin

引用次数: 4

Advanced surface plating on the organic FC-BGA package 有机FC-BGA封装的高级表面电镀

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853263

Y. Tomia, Qiang Wu, A. Maeda, S. Baba, N. Ueda

引用次数: 10

High performance selectively oxidized VCSELs and arrays for parallel high-speed optical interconnects 用于并行高速光互连的高性能选择性氧化vcsel和阵列

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853333

F. Mederer, M. Grabherr, F. Eberhard, I. Ecker, R. Jager, J. Joos, C. Jung, M. Kicherer, R. King, P. Schnitzer, H. Unold, D. Wiedenmann, K. Ebeling

引用次数: 19

Experimental and numerical studies in the evaluation of epoxy-cured fiber optic connectors 环氧树脂固化光纤连接器性能评价的实验与数值研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853287

K. Broadwater, P. Mead

{"title":"Experimental and numerical studies in the evaluation of epoxy-cured fiber optic connectors","authors":"K. Broadwater, P. Mead","doi":"10.1109/ECTC.2000.853287","DOIUrl":"https://doi.org/10.1109/ECTC.2000.853287","url":null,"abstract":"The fiber optic connector (FOC) is a passive optical component that is used in many applications and whose function is to physically and optically link two fiber joints. It is important for the reliability of fiber optic infrastructure to identify the mechanisms of degradation and failure of these components. This paper reviews work at the University of Maryland CALCE Center to accomplish this, including experimental strain analysis utilizing fiber sensors and calculations and models to predict the stresses in FOCs and their effect on the response of the sensors used. In-fiber Bragg grating sensors have been used to study the mechanical strain state in optical fibers that have been terminated in ST connectors. Our findings indicate that terminated sensors experience a compressive strain whose magnitude depends on the cure profile of the epoxy encapsulant used in these connectors. Specifically, we have found that room temperature cures result in lower strain as compared to thermally cured samples. The measured strain magnitude is also believed to be sensitive to the position of the sensor along the axis of the connector. It is believed that to adequately account for such phenomena to occur and predict failure and degradation of the connector, the behavior and response of the epoxy encapsulant is a key consideration.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"409 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133322734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1