Studies on a reflowable underfill for flip chip application

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853171

Tie Wang, C. Lum, J. Kee, T. H. Chew, P. Miao, L. Foo, C. Lin

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引用次数: 4

Abstract

This paper presents the material properties, assembly process identification and reliability performance coupled with failure analysis of a newly developed reflowable underfill. The curing profile, glass transition temperature (Tg), coefficient of thermal expansion (CTE) and modules were investigated via differential scanning calorimeter (DSC), thermo-mechanical analyzer (TMA) and dynamic mechanical analyzer (DMA), respectively. The dependence of viscosity on aging time was measured via Brookfield viscometer. Wettability was demonstrated through solder sphere wetting test. In addition, the effect of reflow profile on wettability was evaluated as well, for example, the variation of overall acid number under several reflow profiles was monitored via titration with standard sodium hydroxide (NaOH) solution. After that, approaches to control voids were made by manipulating material aging time and adjusting reflow profile, and the effects were subsequently identified via scanning acoustic microscopy (C-SAM).

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倒装芯片用可回流底填料的研究

本文介绍了一种新型可回流充填体的材料特性、装配工艺识别、可靠性性能及失效分析。通过差示扫描量热仪(DSC)、热-机械分析仪(TMA)和动态机械分析仪(DMA)分别对固化曲线、玻璃化转变温度(Tg)、热膨胀系数(CTE)和模块进行了研究。通过布鲁克菲尔德粘度计测定了粘度随老化时间的变化规律。通过焊锡球润湿试验验证了其润湿性。此外，还评估了回流剖面对润湿性的影响，例如，通过标准氢氧化钠溶液滴定，监测了几种回流剖面下总酸值的变化。之后，通过控制材料老化时间和调整回流曲线来控制空隙，并随后通过扫描声学显微镜(C-SAM)来确定效果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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