倒装芯片组件中无流下填料的粘附特性及其与可靠性的相关性

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853173

Jicun Lu, B. Smith, D. Baldwin

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引用次数: 5

摘要

附着力是用于倒装芯片组件的底填料的关键性能之一。本文利用剪切试验技术表征了无流底填料对各种钝化模的粘附强度。提出了一种新型的模具与衬底之间有平面下填层的剪切试验车。无流下填料在剪切试验中的粘接强度和破坏模式与其热冲击可靠性试验结果吻合较好。研究了无焊点互连的倒装芯片组件和剪切测试车辆组件之间的分层和裂纹等与下填充层粘合相关的故障。

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Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability

Adhesion is one of the key properties of underfills used in flip chip assemblies. This paper characterizes the adhesion strengths of no-flow underfill materials to various die passivations using the shear test techniques. A novel shear test vehicle with planar underfill layers between the die and substrate is presented. The adhesion strengths and failure modes of the no-flow underfill materials during shear testing correlate well with their thermal shock reliability test results. Underfill adhesion related failures such as delamination and crack are investigated and correlated between flip chip assemblies and shear test vehicle assemblies without solder joint interconnects.

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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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