2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)最新文献_第8页

A new method for comparing migration abilities of conductor systems based on conventional electroanalytical techniques 一种基于传统电分析技术比较导体系统迁移能力的新方法

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853443

G. Harsányi, G. Inzelt

引用次数: 5

Embedded passive components in MCM-D for RF applications 用于射频应用的MCM-D中的嵌入式无源元件

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853150

Chul-Won Ju, Sang-Pok Lee, Young-Min Lee, Seak-Bong Hyun, Seong-Su Park, Min-Kyu Song

引用次数: 11

Distance learning in thermal design of electronic systems - the IEEE/NSF project 电子系统热设计的远程学习- IEEE/NSF项目

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853341

Y. Joshi, J. Sircar, A. Bar-Cohen, S. Bhavnani, J. Barnes

{"title":"Distance learning in thermal design of electronic systems - the IEEE/NSF project","authors":"Y. Joshi, J. Sircar, A. Bar-Cohen, S. Bhavnani, J. Barnes","doi":"10.1109/ECTC.2000.853341","DOIUrl":"https://doi.org/10.1109/ECTC.2000.853341","url":null,"abstract":"A three-year collaborative effort initiated by three institutions has resulted in a new paradigm for distance learning in rapidly evolving technology areas, such as electronics packaging. From the start, the team emphasized the use of multi-media technology for creating and disseminating internet delivered, re-configurable, shared modular educational materials. These modules could be used in a stand-alone fashion for re-training, or embedded in existing courses in various curricula. Using these modules, the first offering of a one semester graduate course on thermal design of electronic systems was made during Spring 1999. This included participants not only from the three original universities, but also from the industry and other universities. This course was taught once a week for three hours, live over the internet. In addition, course materials asynchronously available on the web included Power Point slides of the notes, streaming video, computational codes and virtual laboratory tours. During the second offering of this course during Spring 2000, a number of additional features have been implemented, including expanded participation and greater collaboration. This paper will concentrate on the lessons learned from teaching the second generation of this course. Ongoing efforts involving module standardization will also be described.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128736247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Warpage studies of HDI test vehicles during various thermal profiling HDI试验车辆在不同热剖面下的翘曲研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853438

G. Petriccione, Charles Ume

引用次数: 12

Novel die attach films having high reliability performance for lead-free solder and CSP 新型无铅焊料和CSP贴片具有高可靠性

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853432

S. Takeda, T. Masuko

引用次数: 13

A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals 高速信号微带叠层对传输线的测量与仿真研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853208

Y. Odate, T. Usami, K. Otsuka, T. Suga

引用次数: 3

Review of the reliability of advanced component packaging technologies 先进元件封装技术的可靠性综述

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853430

P. Nemeth, Z. Illyefalvi-Vitéz, G. Harsányi

引用次数: 6

High speed packaged electroabsorption modulators for optical communications 光通信用高速封装电吸收调制器

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853198

A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds

引用次数: 3

Direct generation of Spice compatible passive reduced order models of ground/power planes 直接生成Spice兼容被动降阶模型的地面/动力飞机

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853247

M. J. Choi, Kyu-Pyung Hwang, N. Cangellaris

{"title":"Direct generation of Spice compatible passive reduced order models of ground/power planes","authors":"M. J. Choi, Kyu-Pyung Hwang, N. Cangellaris","doi":"10.1109/ECTC.2000.853247","DOIUrl":"https://doi.org/10.1109/ECTC.2000.853247","url":null,"abstract":"The continuing growth of complexity in modern ULSI design, combined with sub-nanosecond switching speeds, have made necessary the careful assessment of issues such as interplane capacitance, decoupling capacitor selection and placement, as well as resonance effects in the power distribution network. Toward this objective, various research groups have proposed modeling methodologies based on a two-dimensional approximation of Maxwell's equations in the space between adjacent power/ground planes. In this paper, a solid power/ground plane pair is discretized by a distributed RLCG circuit. The resulting discrete model is used in conjunction with the passive reduced-order modeling algorithm PRIMA for the generation of low order, multi-port macromodels to be incorporated in non-linear circuit simulators such as SPICE. Through a rigorous mathematical and physical investigation of the distributed electromagnetic effects between power/ground planes, reliable estimates for the order of the reduced model are derived for accurate multiport modeling over a given frequency bandwidth. The numerical results show that the generated rules provide the robustness required for the numerical generation of guaranteed-passive, reduced order electrical models for power/ground plane structures of optimum complexity.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"107 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120942334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

A manufacturing perspective of wafer level CSP 晶圆级CSP的制造展望

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI: 10.1109/ECTC.2000.853126

L. Nguyen, N. Kelkar, H. Takiar

引用次数: 12