{"title":"新型无铅焊料和CSP贴片具有高可靠性","authors":"S. Takeda, T. Masuko","doi":"10.1109/ECTC.2000.853432","DOIUrl":null,"url":null,"abstract":"Properties and reliability of two kinds of die attach films were studied. A die attach film DF-335-7 developed for high temperature reflow soldering due to a lead(Pb)-free solder, was composed of a modified polyimide base resin, a thermosetting resin, and a silver filler. Relationships among peel strength, work of adhesion, water absorption, package crack resistance, and composition of the film were discussed. Another die attach film DF-400 for new advanced packages such as a Fine-pitch Ball Grid Array (F-BGA) and a Chip Scale Package (CSP) was studied. Relationships among chip warpage, attaching temperature, glass transition temperature (Tg) of a base resin, and package crack resistance were discussed.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Novel die attach films having high reliability performance for lead-free solder and CSP\",\"authors\":\"S. Takeda, T. Masuko\",\"doi\":\"10.1109/ECTC.2000.853432\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Properties and reliability of two kinds of die attach films were studied. A die attach film DF-335-7 developed for high temperature reflow soldering due to a lead(Pb)-free solder, was composed of a modified polyimide base resin, a thermosetting resin, and a silver filler. Relationships among peel strength, work of adhesion, water absorption, package crack resistance, and composition of the film were discussed. Another die attach film DF-400 for new advanced packages such as a Fine-pitch Ball Grid Array (F-BGA) and a Chip Scale Package (CSP) was studied. Relationships among chip warpage, attaching temperature, glass transition temperature (Tg) of a base resin, and package crack resistance were discussed.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853432\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel die attach films having high reliability performance for lead-free solder and CSP
Properties and reliability of two kinds of die attach films were studied. A die attach film DF-335-7 developed for high temperature reflow soldering due to a lead(Pb)-free solder, was composed of a modified polyimide base resin, a thermosetting resin, and a silver filler. Relationships among peel strength, work of adhesion, water absorption, package crack resistance, and composition of the film were discussed. Another die attach film DF-400 for new advanced packages such as a Fine-pitch Ball Grid Array (F-BGA) and a Chip Scale Package (CSP) was studied. Relationships among chip warpage, attaching temperature, glass transition temperature (Tg) of a base resin, and package crack resistance were discussed.
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