A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds
{"title":"High speed packaged electroabsorption modulators for optical communications","authors":"A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds","doi":"10.1109/ECTC.2000.853198","DOIUrl":null,"url":null,"abstract":"High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853198","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.