高速信号微带叠层对传输线的测量与仿真研究

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853208

Y. Odate, T. Usami, K. Otsuka, T. Suga

{"title":"高速信号微带叠层对传输线的测量与仿真研究","authors":"Y. Odate, T. Usami, K. Otsuka, T. Suga","doi":"10.1109/ECTC.2000.853208","DOIUrl":null,"url":null,"abstract":"In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals\",\"authors\":\"Y. Odate, T. Usami, K. Otsuka, T. Suga\",\"doi\":\"10.1109/ECTC.2000.853208\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853208\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853208","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

在高频传输中，由于强电场和强磁场的作用，对相邻线路的串扰增加。在本文中，我们提出了一种新的传输结构，特别是在CPU和存储器之间的总线，用于高频范围。在电磁场分析方面，通过测量和仿真研究，证实了新结构的优越性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals

In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

自引率

0.00%

发文量