{"title":"高速信号微带叠层对传输线的测量与仿真研究","authors":"Y. Odate, T. Usami, K. Otsuka, T. Suga","doi":"10.1109/ECTC.2000.853208","DOIUrl":null,"url":null,"abstract":"In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals\",\"authors\":\"Y. Odate, T. Usami, K. Otsuka, T. Suga\",\"doi\":\"10.1109/ECTC.2000.853208\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853208\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853208","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals
In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis.