Review of the reliability of advanced component packaging technologies

Abstract

Reliability is one of the most important questions in any applications both on package (component), and on board (system) level. In particular, the reliability requirements of automotive under-hood applications are very severe and diverse. Lifetime of an under-hood electronic unit must be 10...20 years, the operation temperature range is -40...150/spl deg/C (depending on the application zone) and the acceleration is 4 g...100 g. The reliability data presented by different component manufacturers were analyzed, compared and evaluated. From the point of view of the analyzed component types, ball grid array packages (BGAs) are in the focus, since they are being considered as replacements for peripheral-leaded plastic quad flat packs (PQFPs) for most future electronics applications. In general, BGAs include packages made of plastic (PBGA) or ceramic (CBGA) materials, using conventional or tape automated bonding (TAB) construction (TBGA), and of very small dimensions called chip scale packages (CSPs). A multichip module packaged in appropriate format is also considered BGA.