光通信用高速封装电吸收调制器

A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds
{"title":"光通信用高速封装电吸收调制器","authors":"A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds","doi":"10.1109/ECTC.2000.853198","DOIUrl":null,"url":null,"abstract":"High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"High speed packaged electroabsorption modulators for optical communications\",\"authors\":\"A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds\",\"doi\":\"10.1109/ECTC.2000.853198\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853198\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853198","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

采用集成模式转换器的InGaAsP材料体系制备了高速封装电吸收调制器。封装的器件具有43 GHz调制带宽,-10 dB电回波损耗和2Vp-p的10 dB消光。介绍了高速器件的器件设计和封装考虑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High speed packaged electroabsorption modulators for optical communications
High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.
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