A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds
{"title":"光通信用高速封装电吸收调制器","authors":"A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds","doi":"10.1109/ECTC.2000.853198","DOIUrl":null,"url":null,"abstract":"High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"High speed packaged electroabsorption modulators for optical communications\",\"authors\":\"A. Bond, G. Shtengel, P. Singh, Y. Akulova, C. Reynolds\",\"doi\":\"10.1109/ECTC.2000.853198\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853198\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853198","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High speed packaged electroabsorption modulators for optical communications
High speed packaged electroabsorption modulators are fabricated from the InGaAsP material system with integrated mode converters. The packaged devices exhibit 43 GHz modulation bandwidth, -10 dB electrical return loss, and 10 dB extinction for 2Vp-p. Device design and package considerations for high speed devices is presented.