Automation manufacturing systems technology for opto-electronic device packaging

Abstract

In an effort to provide next-generation breakthroughs in photonics device manufacturing cost reduction and yield improvement, several new automation technologies have been developed and tested. Currently there are various fiber pigtailing assembly techniques successfully used in the industry including, epoxy, solder, mechanical fixture, and laser welding-the latter being the attachment technique most conducive to automation. While there have been substantial advancements at the optical sub-module level to address the low cost, high volume production issues, no well established device-handling strategy exists that can be deployed along the various phases of the manufacturing line. In this paper significant advancements in the areas of parts-handling, assembly automation, sub-micron weld-shift control, and automated post-weld fiber adjustment capabilities will be covered, along with examples of currently achievable device assembly processes. This multi-dimensioned device manufacturing automation strategy is based on some typical device designs and corresponding assembly and qualification processes currently used in the photonics device industry.