CSP assembly reliability and effects of underfill and double-sided population

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853183

R. Ghaffarian

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引用次数: 13

Abstract

The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP many challenges were identified regarding aspects of technology implementation. Last year, ball shear test results before and after isothermal aging were presented and compared to ball grid array packages. These package were assembled on single- and double sided printed circuit board (PWB) without and with underfill. These test vehicles are subjected to various environmental tests including four thermal cycling conditions. These cycles represent the extreme harsh accelerated testing in the range of -55 to 125/spl deg/C to a commercial requirement in the range of 0 to 100/spl deg/C. This paper presents the thermal cycling test results to 2,000 cycles performed under different environmental conditions for single- and double-sided assemblies with and without underfill.

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聚光聚光组件的可靠性及其对下填料和双面人口的影响

由jpl领导的MicrotypeBGA联盟由代表政府机构和私营公司的企业组成，他们联合起来为各种项目开发芯片规模封装(csp)的质量和可靠性提供实物资源。在构建CSP联盟的过程中，在技术实施方面发现了许多挑战。去年，给出了等温老化前后的球剪试验结果，并与球栅阵列封装进行了比较。这些封装组装在单面和双面印刷电路板(PWB)没有和有底料。这些测试车辆经受各种环境测试，包括四种热循环条件。这些循环代表了在-55至125/spl°C范围内的极端苛刻的加速测试，以及在0至100/spl°C范围内的商业要求。本文介绍了在不同环境条件下对带底填料和不带底填料的单面和双面组件进行的2000次热循环试验结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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