Meeting the heat removal requirements of 'tiled' compliant wafer level packages

Abstract

The 'tiling' of wafer level packages yields the maximum increase in the performance and the packing efficiency. The limitations on the 'tiling' are posed by the capability of removing the heat from all the applications ranging from low power to high power. This paper presents a thorough analysis of the optimum thermal design of the wafer level package and the system assembly to meet the high performance heat removal requirements while maintaining the 'tiled' assembly. The results indicate that even with heat sink fin aspect ratio of 100:1, it is not possible to remove the heat from the 'tiled' high performance wafer level package assembly. An optimum methodology is developed to determine the placement of components on the beard such that the heat can be removed without sacrificing the 'tiled' assembly. By using this methodology, the fin aspect ratio of 25 and 50 is sufficient to meet the cost performance and high performance applications' heat removal requirements, respectively.