IEEE Transactions on Parts, Hybrids, and Packaging最新文献_第9页

Electrical Characteristics of a Two-Level Single Ground-Plane Interconnection in Josephson Tunneling Logic 约瑟夫森隧道逻辑中两电平单地平面互连的电特性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135139

Ying L. Yao

引用次数: 0

Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface 导体和对流表面热阻的理论计算

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135130

G. Ellison

引用次数: 6

New Type Thermal Printing Head Using Thin Film 新型薄膜热敏打印头

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135137

S. Shibata, K. Murasugi, K. Kaminishi

引用次数: 21

Hybrid Protective Device for MOS-LSI Chips MOS-LSI芯片混合保护装置

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135132

F. D. L. Moneda, David E. DeBar, K. Stuby, C. Bertin

引用次数: 5

A Solid-State Variable Resistor Using a Junction FET 使用结场效应管的固态可变电阻

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135131

E. Sugita, T. Yasuda, T. Matsumoto

引用次数: 1

Moisture, Myths, and Microcircuits 湿度，神话和微电路

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135142

R. Thomas

引用次数: 51

Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl 2 封装和未封装Ti-Pd-Au薄膜导体在Cl 2污染环境中的偏湿性能

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135141

N. Sbar

{"title":"Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl 2","authors":"N. Sbar","doi":"10.1109/TPHP.1976.1135141","DOIUrl":"https://doi.org/10.1109/TPHP.1976.1135141","url":null,"abstract":"Both encapsulated and unencapsulated Ti-Pd-Au thin-film conductors on AI 2 O 3 substrates were biased in an 85°C 80-percent RH environment contaminated with Cl 2 . The encapsulant was an RTV silicone rubber. During exposure to the corrosive environment, leakage currents between adjacent conductors were periodically measured and recorded. Leakage currents for the unencapsulated specimens increased with time, and many were shorted after approximately 400 h. In contrast to this behavior, there were no increases in leakage currents for the silicone rubber encapsulated conductors. At the end of the test, selected specimens were examined using a light microscope and an SEM with X-ray capability. No metal migration was observed on the encapsulated samples. The unencapsulated conductors showed dendritic growth between the electrodes; X-ray analysis showed the growths to consist of both Au and Pd. It is concluded that the RTV silicone encapsulant effectively prevents high leakage currents and subsequent metal migration on biased Ti-Pd-Au conductor specimens exposed to a moist Cl 2 environment. Unencapsulated samples are rapidly degraded under the same conditions with the main failure mechanism being metal migration.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127890629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 31

The Mechanics of Gold Beam Leads During Thermocompression Bonding 热压缩键合过程中金束引线的力学

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135140

J. Dais

{"title":"The Mechanics of Gold Beam Leads During Thermocompression Bonding","authors":"J. Dais","doi":"10.1109/TPHP.1976.1135140","DOIUrl":"https://doi.org/10.1109/TPHP.1976.1135140","url":null,"abstract":"An analysis of the stress and deformation in gold beam leads during thermocompression bonding is presented. The analysis isolates two particular bonding processes for study. One has the beams on opposite sides of the chip bonded simultaneously and the other sequentially. Since strains are encountered that are two orders of magnitude greater than the elastic limit, the beam leads are modelled as a work-hardening rigid-plastic material. The independent variables are yield strength, plastic modulus, beam dimensions, chip length, and chip rise (or, bugging height). The dependent variables include strain, beam-centerline geometry, and the force and moment transmitted to the chip. A parametric variation is performed, which shows that increases in yield stress will significantly increase the maximum transmitted force and moment. Increasing beam thickness significantly increases the transmitted force and moment as well as the maximum compressive and tensile strains. Increasing the beam length or decreasing the chip rise will significantly decrease the maximum strains. The results are of interest in the analysis of device damage which occurs during the bonding process. Furthermore, the solution for the beam configuration will be useful in elastic and plastic analyses of power and thermal cycling problems involving goldbeam-lead devices.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117244520","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Electron-Beam-Induced Currents in Simple Device Structures 简单器件结构中的电子束感应电流

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135138

K. Galloway, K. Leedy, W. Keery

引用次数: 11

Evidence of mechanical Film Breakdown and ESCA Analysis of a Film on Thermally Aged Cobalt Hardened Gold 热时效钴硬化金的机械膜击穿证据及ESCA分析

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135129

J. Thomas

引用次数: 2