导体和对流表面热阻的理论计算

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI:10.1109/TPHP.1976.1135130

G. Ellison

{"title":"导体和对流表面热阻的理论计算","authors":"G. Ellison","doi":"10.1109/TPHP.1976.1135130","DOIUrl":null,"url":null,"abstract":"A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards,","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"105 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface\",\"authors\":\"G. Ellison\",\"doi\":\"10.1109/TPHP.1976.1135130\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards,\",\"PeriodicalId\":387212,\"journal\":{\"name\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"volume\":\"105 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1976-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPHP.1976.1135130\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1976.1135130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

推导了常用电子元件和封装盖的导电热阻和对流热阻的封闭理论表达式。数值结果以一种适用于各种器件的方式绘制，例如平面封装，双列式封装和陶瓷电路卡。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface

A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards,

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IEEE Transactions on Parts, Hybrids, and Packaging

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