IEEE Transactions on Parts, Hybrids, and Packaging最新文献

A Study of the Reliability of Microwave Transistors 微波晶体管可靠性研究

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135222

D. Lacombe, R. Naster, J. Carroll

引用次数: 1

The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics 超声焊接机理在微电子铝金线焊接中的应用

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135225

G. Harman, J. Albers

引用次数: 180

High Temperature Properties of Solid Tantalum Chip Capacitors 固体钽片电容器的高温特性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135230

D. Thompson, S. Gunnala

引用次数: 0

Film Capacitors with Low Internal Inductance 具有低内感的薄膜电容器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135227

D. Loescher, N. Sidnell

引用次数: 2

Spurious Signal Generation in Plastic Film Capacitors 塑料薄膜电容器中杂散信号的产生

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135228

J. W. Borough, J. Burnham, W. J. Simmons, S. L. Webster

{"title":"Spurious Signal Generation in Plastic Film Capacitors","authors":"J. W. Borough, J. Burnham, W. J. Simmons, S. L. Webster","doi":"10.1109/TPHP.1977.1135228","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135228","url":null,"abstract":"Plastic film capacitors with dielectric materials such as Mylar or polycarbonate have been observed to generate spurious signals which appear as small spikes in capacitor voltage in the range of 10-300 µV. Such transients repeat at intervals varying from fractions of a second to years, becoming more frequent during periods of temperature change. The tendency to produce this phenomenon can persist for the normal life of the capacitor? depending on thermal and electrical stresses encountered. The effect under study is not related to dielectric breakdown or corona discharge which are due to high electric stress. The observed transients can appear at the capacitor electrodes with either polarity during application of voltage as low as zero. The source of charge and energy for this phenomenon is dielectric absorption (DA) which is history dependant relating directly to the nature of the dielectric material. Materials with high DA such as Mylar are much more susceptible than \"nonpolar\" dielectrics such as polystyrene. The following considerations in minimizing generation of spurious signals are discussed: 1) selection of materials; 2) limitations on use conditions; 3) preconditioning or annealing; 4) capacitor screening techniques.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126636988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

High-Energy Solid-State Electrical Surge Arrestor 高能固态电避雷器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135226

J. Lee, M. Cooper

引用次数: 6

Higher Q from Pot Core Inductors 高Q从锅芯电感

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135229

Fred J. Banzi

引用次数: 2

High Temperature Thermal Characteristics of Microelectronic Packages 微电子封装的高温热特性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135232

Gene K. Baxter, J. Anslow

引用次数: 7

Ceramic-Chip-Capacitor Attachment Ceramic-Chip-Capacitor附件

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135231

M. Seeba, R. Sears

{"title":"Ceramic-Chip-Capacitor Attachment","authors":"M. Seeba, R. Sears","doi":"10.1109/TPHP.1977.1135231","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135231","url":null,"abstract":"Soldering of ceramic-chip capacitors to various kinds of circuit bearing substrates has been accepted ever since capacitors were first introduced to electronic circuit and packaging designers. The palladium-silver end-cap terminals normally Supplied were, in fact, advertised as being solderable with minimum leaching of silver into the solder. Upon a detailed investigation of a capacitor failure it was discovered that a crack had occurred under the end termination of a capacitor and, furthermore, that this crack could not be detected from the outside. Indeed, very careful cross sectioning was required, followed by equally careful microscopic examination. Further investigation led to the conclusion that the crack thus discovered was not an isolated instance of this phenomenon. This paper, and the experimental data it reports, will show that capacitor attachment to alumina substrates using solder causes the capacitors to crack, but that these cracks rarely result in complete electrical failure of the capacitor. The paper will also show that preheating the substrate to a specific temperature during the soldering operation will minimize the cracking phenomenon. While some inferences may be drawn as to the mechanism causing the cracking, the elucidation of this mechanism was not the purpose of the study to be reported here. The elimination of cracking by using conductive epoxy for attaching ceramic-chip capacitors to alumina substrates will be shown.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125538607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

ZnO Varistors for Transient Protection 用于瞬态保护的氧化锌压敏电阻器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-12-01 DOI: 10.1109/TPHP.1977.1135218

L. Levinson, H. Philipp

引用次数: 74