IEEE Transactions on Parts, Hybrids, and Packaging最新文献_第10页

Glass-Passivated Thick-Film Capacitors for RC Circuits RC电路用玻璃钝化厚膜电容器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135133

W. Bratschun

引用次数: 3

A New Center-Tapped Medium-Power Microfilm Resistor 一种新型中心抽头中功率微膜电阻

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135125

L. Bos, W. Ostrander, J. Verhoef

{"title":"A New Center-Tapped Medium-Power Microfilm Resistor","authors":"L. Bos, W. Ostrander, J. Verhoef","doi":"10.1109/TPHP.1976.1135125","DOIUrl":"https://doi.org/10.1109/TPHP.1976.1135125","url":null,"abstract":"A new center-tapped microresistor with high power density capability, good stability, and a high degree of inherent reliability is described. The resistor consists of a 0.075 in2chip 0.022 in thick with two equal-value sputtered tantalum nitride photoetched resistors. Gold-plated copper leads are thermal pulse bonded to evaporated chrome/gold bonding pads. The resistive film is protected with an epoxy coating. Performance data include 10 000 h life at 70°C with 0.2 and 0.4-W dissipation with resistance changes generally under 1 percent. This is equivalent to 70 W/in2of substrate area and up to 1300 W/in2of resistive area. Also included are 10 000 h of 150°C thermal aging, temperature cycle, moisture performance and short time overload, and hot-spot temperature rise versus power dissipated. With heat sinking, short time overload of up to 3 W was successfully applied. Tolerance as manufactured is ±5 percent and stability is generally equivalent to M I L 10509 characteristic C. The product design, manufacturing process, fabrication equipment, and process controls are described. Included are a continuous sputtering machine, an autobonder, an autotester, and a \"binstock\" qualification procedure. Two unusual applications are described. In one, pairs of center-tapped resistors are used as stripline attenuators or as stripline terminations. They are useful at frequencies up to approximately 2 GHz, In the second application, they are used in an ultrahigh-speed computer. All signal conductors are treated as transmission lines and terminated with the microresistor. The computer size is such that just under 500 000 resistors are required. Operation of this computer leads to interesting conclusions regarding field failure rate and require- ments.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131827558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Design Considerations for High-Frequency Ceramic Chip Capacitors 高频陶瓷芯片电容器的设计注意事项

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135135

N. Coda, J. Selvaggi

引用次数: 19

Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion 含硅RTV色散导束器件的集成电路封装

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135126

D. Jaffe

引用次数: 22

A Switchable Active Filter Hybrid 一种可切换的混合有源滤波器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135134

Michael Probstein

引用次数: 0

Miniaturized Aluminum Solid Electrolytic Capacitors Using a Highly Effective Surface Enlargement Technique 采用高效表面放大技术的小型化铝固体电解电容器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135136

K. Hirata, T. Yamasaki

引用次数: 2

How Heat Treatment Affects Film Foil Capacitors 热处理如何影响薄膜电容器

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-09-01 DOI: 10.1109/TPHP.1976.1135128

D. Loescher, C. E. Gumley

{"title":"How Heat Treatment Affects Film Foil Capacitors","authors":"D. Loescher, C. E. Gumley","doi":"10.1109/TPHP.1976.1135128","DOIUrl":"https://doi.org/10.1109/TPHP.1976.1135128","url":null,"abstract":"The effects of heat treatment between 74°C and 130°C on the dc breakdown voltage (V B ) and the change of capacitance with temperature have been determined for capacitors with Mylar film insulation. Some effects of the temperature of heat treatment on discharge life and on the rate of water desorption from rolled capacitors were also determined. It was found that the breakdown voltage decreased from 11.5 kV dc for 0.4-/µF capacitors with 50.8 µm of insulation processed at 74°C to 9.9 kV for similar units processed at 130°C. The change in capacitance associated with a temperature change from -55°C to 74°C was 8.5 percent for the units processed at 74°C and 6.5 percent for units processed at 130°C. Evidence of burning at tabs and at random locations along the foils was found when capacitors heat-treated at 74°C were unrolled after failure in discharge tests. No similar evidence was seen in units processed at 100°C and subjected to the same tests. Finally, results from the water desorption studies show that drying of Mylar capacitors can be accomplished in 10 h or less at temperatures below 74°C. Hence the choice of temperature for processing must be based on a consideration of all requirements placed on a capacitor.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131099757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Statistical Interpretation of Meniscograph Solderability Tests 半月板可焊性试验的统计解释

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-06-01 DOI: 10.1109/TPHP.1976.1135115

J. Jellison, D. Johnson, F. Hosking

{"title":"Statistical Interpretation of Meniscograph Solderability Tests","authors":"J. Jellison, D. Johnson, F. Hosking","doi":"10.1109/TPHP.1976.1135115","DOIUrl":"https://doi.org/10.1109/TPHP.1976.1135115","url":null,"abstract":"As part of a thick-film characterization study, a solderability test-program was initiated utilizing the meniscograph. The meniscograph test measures the changes in wetting force as a function of time, and thus affords a description of the kinematics of the wetting phenomenon. Difficulty was encountered in the derivation of unique parameters which provide consistent statistical comparisons. As an alternate to selecting a time interval from the meniscograph trace as a measure of wetting rate or only qualitatively comparing traces, as some investigators have done, we have evaluated the approach of measuring the slope of the trace replotted so as to yield a straight line fit. A plot of the logarithm of a normalized wetting force versus time has generally afforded the best fit. To evaluate the analytical techniques, a large number of meniscograph tests were conducted employing copper, nickel, and Kovar substrates using both tin-lead and lead-indium solders; and rosin flux with varying activity. With the wetting rate estimated on the basis of the logarithmic line fit, the tests have consistently ranked solder systems with regard to substrate solderability and the activity of fluxes. Calculated equilibrium contact angles were found useful in interpreting the meniscograph traces.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1976-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128948570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Observations of Extreme Cases of Contact Activation 接触激活的极端案例观察

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-06-01 DOI: 10.1109/TPHP.1976.1135109

E. Gray

引用次数: 8

The Heat Sink Effect of Printed Conductors 印刷导体的热沉效应

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-06-01 DOI: 10.1109/TPHP.1976.1135113

F. Wenthen

引用次数: 3