{"title":"Glass-Passivated Thick-Film Capacitors for RC Circuits","authors":"W. Bratschun","doi":"10.1109/TPHP.1976.1135133","DOIUrl":null,"url":null,"abstract":"The advantages, disadvantages, and the reasons for the limited usage of thick-film capacitors are discussed. The electrical and environmental properties of a glass-passivated high dielectric constant (HiK) (~1000) capacitor which does not require hermetic packaging are described. Design criteria for achieving a Iow-cost thick-film capacitor-resistor-conductor network are presented. These include: 1) satisfying multiple circuit requirements; 2) using many capacitors, resistors, and conductors per circuit or per processing operation; 3) using Iow-cost materials, sealing techniques, and processes; 4) achieving high yields. An example is cited of a television tuner circuit on a 2 X 3 X 0.040-in substrate utilizing 47 resistors, 30 capacitors, 8 crossovers, and 1 ground plane in which the substrate also serves as a printed,circuit board for mounted discrete components.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1976.1135133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The advantages, disadvantages, and the reasons for the limited usage of thick-film capacitors are discussed. The electrical and environmental properties of a glass-passivated high dielectric constant (HiK) (~1000) capacitor which does not require hermetic packaging are described. Design criteria for achieving a Iow-cost thick-film capacitor-resistor-conductor network are presented. These include: 1) satisfying multiple circuit requirements; 2) using many capacitors, resistors, and conductors per circuit or per processing operation; 3) using Iow-cost materials, sealing techniques, and processes; 4) achieving high yields. An example is cited of a television tuner circuit on a 2 X 3 X 0.040-in substrate utilizing 47 resistors, 30 capacitors, 8 crossovers, and 1 ground plane in which the substrate also serves as a printed,circuit board for mounted discrete components.