The Heat Sink Effect of Printed Conductors

F. Wenthen
{"title":"The Heat Sink Effect of Printed Conductors","authors":"F. Wenthen","doi":"10.1109/TPHP.1976.1135113","DOIUrl":null,"url":null,"abstract":"The conductors on a printed wiring board can play a significant role in removing heat from electrical components. This paper describes a method of estimating the impact such conductors have on component temperatures. It provides a series of equations and charts for estimating the thermal resistance from one end of a conductor, through the major heat paths to the ambient. The analysis accounts for the effects of temperature gradients within the conductor and within the board. Curves of thermal resistance for typical printed wiring board conductors in a natural convection environment are given. An example problem is also given and the result, using the charts, is compared to the result obtained using a finite difference computer solution. Agreement from the two approaches is within 4 percent.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1976.1135113","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

The conductors on a printed wiring board can play a significant role in removing heat from electrical components. This paper describes a method of estimating the impact such conductors have on component temperatures. It provides a series of equations and charts for estimating the thermal resistance from one end of a conductor, through the major heat paths to the ambient. The analysis accounts for the effects of temperature gradients within the conductor and within the board. Curves of thermal resistance for typical printed wiring board conductors in a natural convection environment are given. An example problem is also given and the result, using the charts, is compared to the result obtained using a finite difference computer solution. Agreement from the two approaches is within 4 percent.
印刷导体的热沉效应
印刷线路板上的导体在消除电子元件的热量方面起着重要作用。本文描述了一种估算此类导体对元件温度影响的方法。它提供了一系列的方程和图表来估计从导体的一端,通过主要的热路径到环境的热阻。该分析考虑了导体和电路板内部温度梯度的影响。给出了典型印制板导体在自然对流环境下的热阻曲线。最后给出了一个算例,并将所得到的结果与有限差分计算机解的结果进行了比较。两种方法的一致性在4%以内。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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