{"title":"新型薄膜热敏打印头","authors":"S. Shibata, K. Murasugi, K. Kaminishi","doi":"10.1109/TPHP.1976.1135137","DOIUrl":null,"url":null,"abstract":"This paper describes the development of a new type thermal printing head. The main features of this paper are as follows. 1) The heating element is a Ta 2 N thin-film resistor coated with a SiO 2 -Ta 2 O 5 double layer. The SiO 2 layer prevents oxidation of Ta 2 N; the Ta 2 O 5 layer, which rubs directly against the heat-sensitive paper, is hard enough to resist abrasion. 2) A theoretical calculation revealed that the thermal time constant can be controlled by changing the thickness of the heat insulating layer. It was found that a glazed alumina ceramic substrate has the most suitable thermal properties. 3) A beam-lead diode array and a crossover structure have been developed to satisfy the electrical interface requirements of both the thermal printing head and the external logic.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"New Type Thermal Printing Head Using Thin Film\",\"authors\":\"S. Shibata, K. Murasugi, K. Kaminishi\",\"doi\":\"10.1109/TPHP.1976.1135137\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the development of a new type thermal printing head. The main features of this paper are as follows. 1) The heating element is a Ta 2 N thin-film resistor coated with a SiO 2 -Ta 2 O 5 double layer. The SiO 2 layer prevents oxidation of Ta 2 N; the Ta 2 O 5 layer, which rubs directly against the heat-sensitive paper, is hard enough to resist abrasion. 2) A theoretical calculation revealed that the thermal time constant can be controlled by changing the thickness of the heat insulating layer. It was found that a glazed alumina ceramic substrate has the most suitable thermal properties. 3) A beam-lead diode array and a crossover structure have been developed to satisfy the electrical interface requirements of both the thermal printing head and the external logic.\",\"PeriodicalId\":387212,\"journal\":{\"name\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1976-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPHP.1976.1135137\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1976.1135137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes the development of a new type thermal printing head. The main features of this paper are as follows. 1) The heating element is a Ta 2 N thin-film resistor coated with a SiO 2 -Ta 2 O 5 double layer. The SiO 2 layer prevents oxidation of Ta 2 N; the Ta 2 O 5 layer, which rubs directly against the heat-sensitive paper, is hard enough to resist abrasion. 2) A theoretical calculation revealed that the thermal time constant can be controlled by changing the thickness of the heat insulating layer. It was found that a glazed alumina ceramic substrate has the most suitable thermal properties. 3) A beam-lead diode array and a crossover structure have been developed to satisfy the electrical interface requirements of both the thermal printing head and the external logic.