热时效钴硬化金的机械膜击穿证据及ESCA分析

J. Thomas
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引用次数: 2

摘要

化学分析电子能谱(ESCA)测定了钴硬化金电镀板(150°C/8000 h)上热生长膜的化学配方。在钴硬化金上覆盖50 a厚的CoO层,确定了K2S04(或SO3) ~ 60 a的厚度。结果表明,该复合薄膜的介电击穿电压与接触力有关。在低接触力(~10-2N)下,在~ 3.5 V的临界电压下观察到电子(而不是热)介电击穿事件。I-V特性通常是非欧姆的。机械薄膜击穿是由欧姆- I-V特性证明的。在0.2 n的接触力下观察到具有统计学意义的机械突破事件数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evidence of mechanical Film Breakdown and ESCA Analysis of a Film on Thermally Aged Cobalt Hardened Gold
Electron spectroscopy for chemical analysis (ESCA) has been used to determine the chemical formulation of thermally grown films on cobalt hardened-gold electroplate (150°C/8000 h). K2S04 (or SO3) ~ 60-A, thickness has been identified overlaying a 50-A-thick CoO layer on cobalt hardened gold. It was found that the dielectric breakdown voltage of this complex film depends on contact force. At Iow contact forces (~10-2N), electronic (as opposed to thermal) dielectric breakdown events are observed at a critical voltage of ~ 3.5 V. I-V characteristics are typically nonohmic. Mechanical film breakdown is evidenced by ohmic I-V characteristics. A statistically important number of mechanical breakthrough events are observed at 0.2-N contact force.
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