IEEE Transactions on Parts, Hybrids, and Packaging最新文献_第7页

A Test of Noble Metal Slip-Ring Alloys for Use in Inertial Guidance Platforms 用于惯性制导平台的贵金属滑环合金试验

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-03-01 DOI: 10.1109/TPHP.1977.1135164

S. Cole, B. Witherspoon, C. Reed, N. Lewis

引用次数: 2

Electric and Spectroscopic Characterization of Arcing in Electrical Contacts: A Study of Erosion 电触点电弧的电学和光谱表征:腐蚀的研究

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-03-01 DOI: 10.1109/TPHP.1977.1135178

J. Treguier, N. Jemaa, D. Collobert, H. Prigent, J. Queffelec

引用次数: 11

Anomalous Behavior of Reed Relays Under Accelerated Life-Test Conditions 簧片继电器在加速寿命试验条件下的异常行为

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-03-01 DOI: 10.1109/TPHP.1977.1135170

J. Brady

引用次数: 0

Reliability of Clad Metal Inlays for Electrical Connectors 电连接器用覆层金属嵌体的可靠性

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1977-03-01 DOI: 10.1109/TPHP.1977.1135171

F. Lee

{"title":"Reliability of Clad Metal Inlays for Electrical Connectors","authors":"F. Lee","doi":"10.1109/TPHP.1977.1135171","DOIUrl":"https://doi.org/10.1109/TPHP.1977.1135171","url":null,"abstract":"Following the prior publication [ 1 ], we tested more connector hardware of clad metal inlays the quality of which is quite close to the production level. In other words, the spring base material was all made of beryllium copper fully heat-treated after forming. The springs were punched and formed with a production the spring gaps were more uniform and all within the specified range, though in the high end. The inlay materials used in this extended test were: a) 18K Au (75Au25Ag), b) pure palladium (100 Pd), c) Alloy 69Au25Ag6Pt, d) 60Pd40Ag alloy, and e) alloy-55(55Au39Ag3Cd31n). These materials were reported to have relatively better performance among the many candidates we initially studied. The sample size used in these tests was much larger than the previous one; as a result, the experimental data are more reliable and meaningful. Two groups of connector hardware representing today's highdensity miniature electronic packaging were used. One group was the cylinder-cylinder contact, the other was the cylinder-flat contact. Also some discussion was devoted to the dimple-flat contact system. The contact-resistance data were collected over a period of 6 months to 1 year from three kinds of environmental tests. Both porosity and formability were acceptable for all the inlay springs. No wear-through contacts were found after 50 insertions with lubricant applied on the Au or Pd plated pins. All five inlay materials tested behaved almost equally well in their contact-resistance measurements. Previously the 69Au25Ag6Pt was chosen as the best, and the palladium stood as the second best at that time. However, in this paper we have shown that the Pd is clearly the winner in many aspects of the tests. The 69Au25Ag6Pt is equivalent to the 75Au25Ag alloy as the second best choice.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1977-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129605943","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach 混合电路中倒装芯片与片线半导体连接的热比较:一种实验方法

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135146

D. Cavanaugh

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引用次数: 0

The Thermal Design of an LSI Single-Chip Package 一种LSI单芯片封装的散热设计

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135155

G. Ellison

引用次数: 36

Heat Treatment of Dc-Sputtered Tin Dioxide Thin Films 直流溅射氧化锡薄膜的热处理

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135153

A. Sabnis, L. Feisel

引用次数: 8

High-Voltage Damage and Low-Frequency Noise in Thick-Film Resistors 厚膜电阻器的高压损伤与低频噪声

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135152

E. Stevens, D. Gilbert, J. Ringo

引用次数: 26

Failure Modes of Beam-Lead Semiconductors in Thin-Film Hybrid Microcircuits 薄膜混合微电路中导束半导体的失效模式

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135160

J. Swafford

引用次数: 2

On the Interpretation of Noise in Thick-Film Resistors 厚膜电阻器噪声的解释

IEEE Transactions on Parts, Hybrids, and Packaging Pub Date : 1976-12-01 DOI: 10.1109/TPHP.1976.1135147

J. Ringo, E. Stevens, D. Gilbert

引用次数: 9