{"title":"混合电路中倒装芯片与片线半导体连接的热比较:一种实验方法","authors":"D. Cavanaugh","doi":"10.1109/TPHP.1976.1135146","DOIUrl":null,"url":null,"abstract":"An important consideration for the hybrid-circuit manufacturer is the power dissipation of active devices on the circuit. Heat generated in the junctions of the devices affects circuit reliability, performance, and current handling capability. Theory of the thermal characteristics of various chip interconnect methods is available, but results are too generalized to be of much use for circuit design. This paper presents a theoretical consideration, but is primarily an experimental comparison of the thermal characteristics ( \\theta js , \\theta ja , P max ) of solder-bump flip-chip and chip-and-wire attachment techniques under comparable conditions. The 2N2222A transistor electrical specification in flip-chip and in chip form (MMCF2222A and MMCS2222A, respectively) was chosen for the comparison. Substrates were prepared to offer a thermally fair representation of actual usage in the manufacture of hybrid circuits. The effect of conformally coating and directly heat-sinking chips through a substrate is also evaluated. Thermal resistance data from a previous experiment for flip chips, standard chips, and beam leads is offered for com- parison.","PeriodicalId":387212,"journal":{"name":"IEEE Transactions on Parts, Hybrids, and Packaging","volume":"441 1-2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1976-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach\",\"authors\":\"D. Cavanaugh\",\"doi\":\"10.1109/TPHP.1976.1135146\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An important consideration for the hybrid-circuit manufacturer is the power dissipation of active devices on the circuit. Heat generated in the junctions of the devices affects circuit reliability, performance, and current handling capability. Theory of the thermal characteristics of various chip interconnect methods is available, but results are too generalized to be of much use for circuit design. This paper presents a theoretical consideration, but is primarily an experimental comparison of the thermal characteristics ( \\\\theta js , \\\\theta ja , P max ) of solder-bump flip-chip and chip-and-wire attachment techniques under comparable conditions. The 2N2222A transistor electrical specification in flip-chip and in chip form (MMCF2222A and MMCS2222A, respectively) was chosen for the comparison. Substrates were prepared to offer a thermally fair representation of actual usage in the manufacture of hybrid circuits. The effect of conformally coating and directly heat-sinking chips through a substrate is also evaluated. Thermal resistance data from a previous experiment for flip chips, standard chips, and beam leads is offered for com- parison.\",\"PeriodicalId\":387212,\"journal\":{\"name\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"volume\":\"441 1-2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1976-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Parts, Hybrids, and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TPHP.1976.1135146\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Parts, Hybrids, and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPHP.1976.1135146","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
混合电路制造商要考虑的一个重要问题是电路上有源器件的功耗。器件连接处产生的热量会影响电路的可靠性、性能和电流处理能力。各种芯片互连方法的热特性理论是可用的,但结果过于笼统,不能用于电路设计。本文提出了一个理论考虑,但主要是一个实验比较的热特性(\theta js, \theta ja, P max)的焊接-碰撞倒装芯片和芯片-线连接技术在类似的条件下。选择倒装和芯片形式的2N2222A晶体管电气规格(分别为MMCF2222A和MMCS2222A)进行比较。基板的制备是为了提供混合电路制造中实际使用的热公平表示。对共形涂层和直接通过衬底热沉芯片的效果也进行了评价。从先前的倒装芯片、标准芯片和束流引线的实验中获得的热阻数据可供比较。
Thermal Comparison of Flip-Chip Relative to Chip-and-Wire Semiconductor Attachment in Hybrid Circuits: An Experimental Approach
An important consideration for the hybrid-circuit manufacturer is the power dissipation of active devices on the circuit. Heat generated in the junctions of the devices affects circuit reliability, performance, and current handling capability. Theory of the thermal characteristics of various chip interconnect methods is available, but results are too generalized to be of much use for circuit design. This paper presents a theoretical consideration, but is primarily an experimental comparison of the thermal characteristics ( \theta js , \theta ja , P max ) of solder-bump flip-chip and chip-and-wire attachment techniques under comparable conditions. The 2N2222A transistor electrical specification in flip-chip and in chip form (MMCF2222A and MMCS2222A, respectively) was chosen for the comparison. Substrates were prepared to offer a thermally fair representation of actual usage in the manufacture of hybrid circuits. The effect of conformally coating and directly heat-sinking chips through a substrate is also evaluated. Thermal resistance data from a previous experiment for flip chips, standard chips, and beam leads is offered for com- parison.