11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)最新文献

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High voltage Ni/4H-SiC Schottky rectifiers 高压Ni/4H-SiC肖特基整流器
R. Chilukuri, B. J. Baliga
{"title":"High voltage Ni/4H-SiC Schottky rectifiers","authors":"R. Chilukuri, B. J. Baliga","doi":"10.1109/ISPSD.1999.764087","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764087","url":null,"abstract":"In this paper, we report characteristics of 4H-SiC Ni/Al Schottky rectifiers operating at 1.5 to 2.5 kV and terminated using low energy Ar implants. At room temperature, the nickel Schottky diode exhibited a barrier height of 1.7 eV and an ideality factor of 1.07. After annealing, the Schottky diode fabricated on a 20 /spl mu/m thick epilayer had a forward voltage drop of 1.16 V at 100 A/cm/sup 2/, the lowest value ever reported for a 1.6 kV rectifier. A breakdown voltage of >2500 V was measured on diodes fabricated using 40 /spl mu/m epilayers. The measured specific on-resistance of 20 /spl mu/m and 40 /spl mu/m epi diodes was within /spl sim/1.5/spl times/ of the calculated drift region resistance over a 0-200/spl deg/C temperature range.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128976340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Ultra-high resolution temperature measurement and thermal management of RF power devices using heat pipes 使用热管的射频功率器件的超高分辨率温度测量和热管理
Jun He, V. Mehrotra, M. C. Shaw
{"title":"Ultra-high resolution temperature measurement and thermal management of RF power devices using heat pipes","authors":"Jun He, V. Mehrotra, M. C. Shaw","doi":"10.1109/ISPSD.1999.764083","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764083","url":null,"abstract":"A new technique, designated pyrospectroscopy, for measuring temperatures with ultra-high resolution in semiconductor devices is demonstrated. This technique is based on Raman spectroscopy and offers a spatial resolution of about 1 /spl mu/m and a temperature resolution in the 1-2/spl deg/C range. The ability to resolve temperatures at this spatial resolution is demonstrated experimentally in functioning RF power amplifier devices, where heat is concentrated in extremely small emitter regions. Highly localized temperature gradients in a 900-1200 MHz Si power amplifier die are shown. In contrast, these data indicate that the temperatures measured separately by infrared microscopy underestimate the localized device temperature at the same position by as much as 20/spl deg/C. Finally, a unique thermal management approach using heat pipes is demonstrated, which results in a 20% decrease in temperature of a RF power device accompanied by a 55% reduction in thermal resistance for the case investigated.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126991941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Trend of railway technologies and power semiconductor devices 铁路技术和功率半导体器件的发展趋势
T. Watanabe
{"title":"Trend of railway technologies and power semiconductor devices","authors":"T. Watanabe","doi":"10.1109/ISPSD.1999.764032","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764032","url":null,"abstract":"Transportation has a big share of energy consumption, especially automobiles. Railway saves energy in the field of mass freight transportation, commuter services and high-speed medium distance passenger transportation. Shifting transportation media from trucks and automobiles to railways is important for future energy and environmental issues. It is necessary to have high railway productivity to win the competition between transportation media. With regard to high-speed passenger transport, electric multiple units are more advantageous than locomotive hauled trains, and double-deckers have 30% greater productivity than ordinary railway vehicles. Inverters have made great progress due to power semiconductor development. The smaller power convertor offers more passenger room and greater productivity. On-board convertors can be much smaller if we use 3.3 kV and 4.5 kV IGBTs and two level convertors instead of three level ones. Smaller losses and smaller harmonics are expected for these convertors to enable self-cooling and avoid extra measures to satisfy EMC requirements. If 10-40 kV power semiconductors are made, we have the prospect of realizing transformerless railway vehicles for 25 kV AC systems by adding the role of a main transformer of traction circuit to convertors. In addition, electric vehicles with accumulators, hybrid vehicles using both engine and accumulator and cars with fuel cells are discussed for future environment friendly automobiles. Electric traction seems unavoidable for future automobiles, which means a huge market for power convertors and power semiconductor devices in the 21st century.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126476221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
A physics-based model for the avalanche ruggedness of power diodes 功率二极管雪崩坚固性的物理模型
G. Hurkx, N. Koper
{"title":"A physics-based model for the avalanche ruggedness of power diodes","authors":"G. Hurkx, N. Koper","doi":"10.1109/ISPSD.1999.764089","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764089","url":null,"abstract":"The avalanche ruggedness of power diodes is investigated by experiments and numerical device simulations. An analytical model is developed that describes the dependence of the maximum allowable energy during an unclamped inductive switching test on test temperature, diode area, breakdown voltage, hot spots and the critical temperature for the onset of second breakdown.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128168661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Experimental demonstration of 600 V MCCT 600伏MCCT的实验演示
T. Iwaana, N. Iwamuro, Y. Harada, Y. Seki
{"title":"Experimental demonstration of 600 V MCCT","authors":"T. Iwaana, N. Iwamuro, Y. Harada, Y. Seki","doi":"10.1109/ISPSD.1999.764130","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764130","url":null,"abstract":"This paper presents the characteristics of a MCCT (MOS controlled cascode thyristor) device with a blocking capability of 600 V for the first time. It should be noted that a superior on-state voltage drop of 2.0 V can be achieved while exhibiting a fast turn-off speed which is comparable to that of an IGBT. Furthermore, the MCCT shows a superior short circuit withstand capability of more than 16 /spl mu/s and a maximum turn-off capability of over 660 A/cm2 at a high temperature condition of 125/spl deg/C, simultaneously, by the application of an n/n/sup +/ source region structure.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"704 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130213218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fabrication of a double-side IGBT by very low temperature wafer bonding 极低温晶圆键合法制备双面IGBT
K. Hobart, F. Kub, G. Dolny, M. Zafrani, J. Neilson, J. Gladish, C. McLachlan
{"title":"Fabrication of a double-side IGBT by very low temperature wafer bonding","authors":"K. Hobart, F. Kub, G. Dolny, M. Zafrani, J. Neilson, J. Gladish, C. McLachlan","doi":"10.1109/ISPSD.1999.764042","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764042","url":null,"abstract":"A bidirectional double-side IGBT has been successfully fabricated by very low temperature direct wafer bonding for the first time. The utility of the second MOS gate to control hole injection is demonstrated. Through optimized switching of the second gate, a 50% decrease in switching loss is observed.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134024395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
A simple mobility model for electrons and holes 电子和空穴的简单迁移率模型
I. Takata
{"title":"A simple mobility model for electrons and holes","authors":"I. Takata","doi":"10.1109/ISPSD.1999.764115","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764115","url":null,"abstract":"This article reports a trial to find a simple quantitative relation which explains drift mobilities for electrons and holes in various semiconductors on the same point of view as the saturation velocity analysis which was presented at ISPSD'97 by the author (Takata, Proc. ISPSD'97, pp. 133-136, 1997). A newly proposed model was based on the primitive mobility equation (/spl mu//sub d/=q/spl middot//spl tau//sub m//m/sub dr/*) and the factors which determine a momentum relaxation time (/spl tau//sub m/=L/sub m//v/sub eff/) were chosen such that a mean free path (L/sub m/) was equal to the lattice constant (a) times 40 (L/sub m//spl ap/40/spl middot/a) and the effective velocity (v/sub eff/) equalled the thermal velocity (v/sub th/). Then the author tried to find the simplest rule for effective masses (m/sub dr//sup */) to explain the experimental values for electrons and holes in the major indirect-transition-type semiconductors, such as diamond, 4H-SiC, 6H-SiC, 3C-SiC, Si, GaP, AlSb, Ge and GaAs. On many materials, the conductive effective mass (m/sub c//sup */) is fitting for the electron's effective mass (m/sub dr//sup */) and the longitudinal effective mass (m/sub 1//sup */) for the hole's. This model may be useful for evaluation of approximate mobilities for newly developing materials such as SiC or diamond. The author proposes that conventional transport theory has serious problems for such materials, especially in terms of holes. Even if the theory of this paper is not solid, there is room to discuss some new fundamental mechanisms on these subjects.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132961136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
High-performance 13-65 V rated LDMOS transistors in an advanced smart power technology 高性能13- 65v额定LDMOS晶体管采用先进的智能电源技术
S. Merchant, R. Baird, S. Chang, P. Hui, V. Macary, M.G. Neaves
{"title":"High-performance 13-65 V rated LDMOS transistors in an advanced smart power technology","authors":"S. Merchant, R. Baird, S. Chang, P. Hui, V. Macary, M.G. Neaves","doi":"10.1109/ISPSD.1999.764104","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764104","url":null,"abstract":"A high-performance, low cost smart power technology targeting automotive applications in the 13-65 V range is described. The trade-off between on-state specific resistance and off-state breakdown voltage is detailed for four lateral double-diffused MOS structures. The characterization includes the effects of gate length and drift length, and scaling issues related to interconnect metal debiasing. Results compare favorably with competing technologies of higher cost and complexity.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114595437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A new trench bipolar junction diode (TBJD) 一种新型沟槽双极结二极管(TBJD)
B. You, A. Huang, J. Sin
{"title":"A new trench bipolar junction diode (TBJD)","authors":"B. You, A. Huang, J. Sin","doi":"10.1109/ISPSD.1999.764080","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764080","url":null,"abstract":"In this paper, a new power diode structure called the trench bipolar junction diode (TBJD) is proposed. For the first time, the feasibility of controlling the anode injection efficiency of a diode by the action of an integrated reverse active transistor is demonstrated. The base of the reverse active transistor is shielded by a deep p/sup +/ trench region in the TBJD to achieve superior dynamic characteristics compared to the conventional p-i-n diode structure. Both simulation and experimental results are provided to illustrate this novel structure.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114714643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
New design approach for ultra high power GCT thyristor 超高功率GCT晶闸管的新设计方法
K. Satoh, K. Morishita, N. Hirano, M. Yamamoto, A. Kawakami
{"title":"New design approach for ultra high power GCT thyristor","authors":"K. Satoh, K. Morishita, N. Hirano, M. Yamamoto, A. Kawakami","doi":"10.1109/ISPSD.1999.764132","DOIUrl":"https://doi.org/10.1109/ISPSD.1999.764132","url":null,"abstract":"Turn-off capability is a major concern when designing ultra high power, large size GCTs (gate commutated turn-off thyristors). Unlike small size GCTs, which have a high turn-off capability, conventional large size GCTs have a low turn-off capability that is not proportionate to its high power. With the help of computer simulation and test sample evaluation, we developed a new design approach for ultra high power GCTs with improved turn-off capability. Turn-off simulation suggested that the low turn-off capability of large size GCTs is related to the nonuniformity in the GCT chip design. Optimizing the GCT chip uniformity following our new design approach resulted in large size GCTs with higher turn-off capability when compared with the conventional approach.","PeriodicalId":352185,"journal":{"name":"11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)","volume":"06 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129615228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
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