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2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)最新文献

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A high-precision thermal imaging approach based on Bayesian inference for EMC diagnosis 基于贝叶斯推理的高精度热成像电磁兼容诊断方法
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919852
C. Ning, Hou Yaochun, Wu Dazhuan, Zhu Sha, Luo Dingxin
{"title":"A high-precision thermal imaging approach based on Bayesian inference for EMC diagnosis","authors":"C. Ning, Hou Yaochun, Wu Dazhuan, Zhu Sha, Luo Dingxin","doi":"10.1109/EMCCompo.2019.8919852","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919852","url":null,"abstract":"Electro Magnetic Compatibility (EMC) is sensitive to some of unapparent factors such as current leakage, component heating and temperature fluctuation etc. In recent years, thermal imaging techniques with high precision has been investigated for EMC diagnosis due to these unapparent factors. This paper presents a Bayesian inference based thermal imaging approach so as to calibrate temperature distortion on the surface of electronic device. The proposed method improves the thermal radiation model by studying raw data property and updating the model parameters such as measure distance, surrounding humidity, ambient temperature and surface emissivity. Thermal imaging results on ABB controllers and Schneider switches etc. validate the advantages of our proposals in the sense of high-precision, far-field detection and wide-range inspection for EMC enhancement.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132238551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Investigation on the Turn-On Time of Rc-Triggered Power Clamps Based on 0.18-μm BCD Process 基于0.18 μm BCD工艺的rc触发电源钳导通时间研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919942
Yifei Zheng, Xiangliang Jin, Jianfei Wu, Yang Wang, Ang Zhang, Hongli Zhang
{"title":"Investigation on the Turn-On Time of Rc-Triggered Power Clamps Based on 0.18-μm BCD Process","authors":"Yifei Zheng, Xiangliang Jin, Jianfei Wu, Yang Wang, Ang Zhang, Hongli Zhang","doi":"10.1109/EMCCompo.2019.8919942","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919942","url":null,"abstract":"In electrostatic discharge clamp circuit (Power Clamp), turn-on time has always been a critical parameter. Four types power Clamp devices are compared in this paper. The turn-on time is effectively adjusted by feedback and reset of MOS transistors, which is realized in 0.18-$mu $ m BCD Process. The theoretical analysis and transmission line pulse (TLP) testing system are used to predict and characterize the ESD protection devices. Through analysis of HSPICE simulation and measurement results, it can be drawn that when the turn-on time is about 100 ns, the equivalent HBM values of power-rail ESD clamp circuit can achieve the best results (approximately 10 kV).","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"28 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132286337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Potential Applicability of Single-Walled Carbon Nanotube Through-Silicon Vias for Differential Signal Transmission 单壁碳纳米管通硅孔在差分信号传输中的潜在适用性
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/emccompo.2019.8919672
Qing-Hao Hu, Wensheng Zhao, Gaofeng Wang, Dawei Wang
{"title":"Potential Applicability of Single-Walled Carbon Nanotube Through-Silicon Vias for Differential Signal Transmission","authors":"Qing-Hao Hu, Wensheng Zhao, Gaofeng Wang, Dawei Wang","doi":"10.1109/emccompo.2019.8919672","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919672","url":null,"abstract":"Circuit model for vertically aligned carbon nanotube (CNT) array-filled differential through-silicon vias (DTSVs) is presented and investigated. The frequency-dependent impedance is extracted by using partial-element equivalent-circuit (PEEC) method. Based on the circuit model, the electrical performance of the proposed D-TSVs is investigated.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127780007","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study of Fields Above Differential Microstrip lines for Probe Characterization Application 差分微带线上磁场在探针表征中的应用研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919781
Xinxin Tian, Yulong Wang, Xuecheng Xu, Zhiyuan He, Heng Zhang, Zeyi Li, Rongquan Chen, Meizhen Xiao, Weiheng Shao, Wenxiao Fang, Duo-long Wu, Lei Wang, Hengzhou Liu
{"title":"Study of Fields Above Differential Microstrip lines for Probe Characterization Application","authors":"Xinxin Tian, Yulong Wang, Xuecheng Xu, Zhiyuan He, Heng Zhang, Zeyi Li, Rongquan Chen, Meizhen Xiao, Weiheng Shao, Wenxiao Fang, Duo-long Wu, Lei Wang, Hengzhou Liu","doi":"10.1109/EMCCompo.2019.8919781","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919781","url":null,"abstract":"The spatial resolution of probe is defined for a 6-dB level drop point from the peak point close to the edge of the microstrip line. However, this definition is not clear for strongly coupled traces. If the spacing between adjacent traces is small enough, the probe may not detect multiple sources. In this paper, near fields above differential microstrip lines are investigated numerically and theoretically for probe characterization of spatial resolution. Results show several limiting cases for the probe to discriminate two RF sources in close proximity. It is discovered that two traces can be easily distinguished with differential mode excitation, while the detection for the common mode excitation cases is affected by probe height and trace spacing.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121397772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of Tone Reservation-based PAPR Techniques for Improving Power Amplifier Efficiency 基于音调保留的PAPR技术提高功放效率的研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919786
Congzheng Han, S. Armour
{"title":"Investigation of Tone Reservation-based PAPR Techniques for Improving Power Amplifier Efficiency","authors":"Congzheng Han, S. Armour","doi":"10.1109/EMCCompo.2019.8919786","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919786","url":null,"abstract":"OFDM suffers from high peak-to-average power ratio (PAPR), and these large peaks require a linear (i.e. with a large input back-off) and consequently inefficient power amplifier (PA) at the analogue radio frequency (RF) front-end. This paper will investigate the potential improvement in PA efficiency and RF energy savings achieved through tone reservation-based PAPR reduction methods.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125987091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Determining the Emission of a Device from the Near Field of an IC 从集成电路近场确定器件的发射
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919685
G. Langer, Jörg Hacker
{"title":"Determining the Emission of a Device from the Near Field of an IC","authors":"G. Langer, Jörg Hacker","doi":"10.1109/EMCCompo.2019.8919685","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919685","url":null,"abstract":"EMC parameters of complex ICs are unknown. Therefore the simulation of the emission of electronic devices is challenging. The article introduces a method to describe ICs by an equivalent current. It is explained how this current can be determined metrological and used for a calculation of the far field. Any IC can be characterized by an equivalent current. Hence, the equivalent current can be used as a global IC EMC parameter.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125416212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Electromagnetic Susceptibility and Nonlinearity of Voltage Reference 参考电压的电磁磁化率和非线性
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919815
Z. An, Z. Han, J. Wu, L. Yu, B. Li, W. Zhao, B. Lu, J. Gao, S. Wei, J. Luo
{"title":"Electromagnetic Susceptibility and Nonlinearity of Voltage Reference","authors":"Z. An, Z. Han, J. Wu, L. Yu, B. Li, W. Zhao, B. Lu, J. Gao, S. Wei, J. Luo","doi":"10.1109/EMCCompo.2019.8919815","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919815","url":null,"abstract":"This paper studies the relationship between nonlinearity and electromagnetic susceptibility (EMS) of integrated circuits (ICs). The research object is a voltage reference circuit with two similar architectures. Experiments results show that direct current (DC) shift appeared on the output in the presence of an electromagnetic disturbance on the ground plane and the small difference in architecture resulted in significant differences in EMS. Since the nonlinearity of the circuit, the “gain” of the circuit is constantly changing in the presence of an electromagnetic disturbance. As a result, asymmetric fluctuations are generated on the output, which means DC shift is generated. Different architectures mean different nonlinearity. It can be concluded that the DC shift generated in the presence of electromagnetic disturbance is the result of the nonlinearity of ICs. The stronger the nonlinearity, the easier it is to generate DC shift. Increasing the linearity of ICs can not only improve the electrical characteristics but also decrease the EMS.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122615799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
RF IC Susceptibility of VHF transceiver excited from Power terminal with PCI PCI电源终端激发VHF收发器的射频磁化率
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919914
Congguang Mao, Chuanbao Du, Zheng Liu
{"title":"RF IC Susceptibility of VHF transceiver excited from Power terminal with PCI","authors":"Congguang Mao, Chuanbao Du, Zheng Liu","doi":"10.1109/EMCCompo.2019.8919914","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919914","url":null,"abstract":"In order to determine the failure mechanism of VHF transceiver in electromagnetic environment effects (E3), the pulse current injection (PCI) test is conducted at the power terminal. The test results indicate that the IC server circuit failure of the low noise amplifier (LNA) module is the most underlying cause of the system fault. This illustration displays the specific requirements for IC sensitivity study in E3 compared with the traditional subjects, such as modeling, emission and susceptibility just aiming at IC itself. And the further work need to be done are discussed and suggested finally.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124768912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism 用TAN形式分析PCB互连和封装的灵敏度
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919915
Z. Xu, J. Fan, O. Maurice
{"title":"Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism","authors":"Z. Xu, J. Fan, O. Maurice","doi":"10.1109/EMCCompo.2019.8919915","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919915","url":null,"abstract":"This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron’s mesh impedance tensor obtained via the PCB Kron’s equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130456544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An Online Method for Load Impedance Extraction for Printed Lines based on Near Field Measurements 基于近场测量的印刷线路负载阻抗在线提取方法
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919945
Hui Xu, D. Su
{"title":"An Online Method for Load Impedance Extraction for Printed Lines based on Near Field Measurements","authors":"Hui Xu, D. Su","doi":"10.1109/EMCCompo.2019.8919945","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919945","url":null,"abstract":"In this paper, an online load impedance extraction method for printed lines on the printed circuit boards (PCBs) is proposed. Firstly, the relationship between the conducted current and the magnetic probe voltage is built through the near magnetic field. Secondly, the distributed characteristic of the probe voltage obtained is analyzed by considering the transmission line effect on the microstrip line. Then, the extracted method is proposed and the load impedance can be extracted with the voltage or magnetic field results at two different locations along the printed line. Simulation and measurement experiments are carried out to validate the proposed method. Results shows that the impedances obtained from the proposed method agree well with the setting value.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125695923","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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