用TAN形式分析PCB互连和封装的灵敏度

Z. Xu, J. Fan, O. Maurice
{"title":"用TAN形式分析PCB互连和封装的灵敏度","authors":"Z. Xu, J. Fan, O. Maurice","doi":"10.1109/EMCCompo.2019.8919915","DOIUrl":null,"url":null,"abstract":"This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron’s mesh impedance tensor obtained via the PCB Kron’s equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism\",\"authors\":\"Z. Xu, J. Fan, O. Maurice\",\"doi\":\"10.1109/EMCCompo.2019.8919915\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron’s mesh impedance tensor obtained via the PCB Kron’s equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.\",\"PeriodicalId\":252700,\"journal\":{\"name\":\"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCompo.2019.8919915\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCompo.2019.8919915","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文提出了一种适用于平面PCB板的灵敏度分析的数学方法。这种快速SA基于网络张量分析(Tensorial Analysis of Network, TAN)。基于Kron等效图拓扑得到的Kron网格阻抗张量,建立了SA的数学推导。为了说明该方法的可行性,概念验证(POC),提出了一个简单的带有集总元件模型的微带PCB。研究了从直流到5ghz范围内,POC参数对插入损耗的影响。通过与ADS®参数仿真的比较,证明了基于kron的SA算法的有效性。在我们的方法中找到了影响POC插入损耗最有效的参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sensitivity Analysis of PCB Interconnect and Package with TAN Formalism
This paper presents a mathematical method for the sensitivity analysis (SA) applied to a planar PCB. This fast SA is based on Tensorial Analysis of Network (TAN). The SA mathematical derivations are established based on the Kron’s mesh impedance tensor obtained via the PCB Kron’s equivalent graph topology. To illustrate the method feasibility, the proof of concept (POC), a simple microstrip PCB with lumped element models is proposed. The effects of POC parameters on the insertion loss from DC to 5 GHz are studied. The efficiency of the Kron-based SA is proved by comparing our method with ADS® parametric simulations. The most effective parameter influencing insertion loss of the POC is found within our approach.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信