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2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)最新文献

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Precision All-Optical EMC Test Technique of Integrated Circuits 集成电路精密全光电磁兼容测试技术
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/emccompo.2019.8919713
Bo Yang, Wenhao He, Bang-Xing Gu, M. Dong, Guobin Chen, Li-Wen Xing, G. Du
{"title":"Precision All-Optical EMC Test Technique of Integrated Circuits","authors":"Bo Yang, Wenhao He, Bang-Xing Gu, M. Dong, Guobin Chen, Li-Wen Xing, G. Du","doi":"10.1109/emccompo.2019.8919713","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919713","url":null,"abstract":"Chip-level EMC testing and diagnostic analysis technology plays an important role in the design and development of highly integrated microwave and millimeter-wave chips. In this paper, an all-optical and non-invasive microwave magnetic field scanning probe system based on diamond NV color centers is constructed, with RF B-field sensitivity of 5 nT/√Hz and spatial resolution smaller than 10 micron. The frequency tuning from DC to 100 GHz magnetic resonance can be achieved by Zeeman splitting technique. Full vector reconstruction of microwave near field can be realized with its four crystal axis. The current distribution on the surface of the microchip under test can be deduced by the quantum magnetic field inverse radiation problem solver. The EMC problem on the chip surface can be further analyzed by the current distribution on the chip surface. The experimental system built in this paper verifies the feasibility of the system by microwave near-field imaging of a GaAs MMIC low-pass filter chip with 3dB cut-off frequency of 6GHz.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115736235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Immunity Evaluation of SRAM Chips for SOI and SI Technology 用于SOI和SI技术的SRAM芯片抗扰度评估
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919851
Xujing Wu, Mengjun Wang, Jianfei Wu, Hong Li, Binhong Li, N. Hao, Jiantou Gao, Hongli Zhang
{"title":"Immunity Evaluation of SRAM Chips for SOI and SI Technology","authors":"Xujing Wu, Mengjun Wang, Jianfei Wu, Hong Li, Binhong Li, N. Hao, Jiantou Gao, Hongli Zhang","doi":"10.1109/EMCCompo.2019.8919851","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919851","url":null,"abstract":"This paper mainly studies the electromagnetic immunity of two kinds of static random access memory (SRAM) chips using bulk silicon (SI) and insulator silicon (SOI) technologies respectively, and the effect of temperature on chip immunity. Direct power injection (DPI) method was used to test the immunity of each functional pin of the two chips, and the ground pin was selected to study the immunity under heat stress. The test results show that the immunity of each functional pin is different, the immunity of the same pin is also different under different working states, and the SOI technologies has better immunity than the SI technologies. At the same time, it was found that different temperatures would cause the chip’s immunity threshold to drift. This provides an important reference for the design of the chip immunity.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121269011","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quadrature VCO Via Transformer-coupled Transmission Line 通过变压器耦合传输线的正交压控振荡器
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919938
W. Lai, S. Jang, Jia-Wun Syu
{"title":"Quadrature VCO Via Transformer-coupled Transmission Line","authors":"W. Lai, S. Jang, Jia-Wun Syu","doi":"10.1109/EMCCompo.2019.8919938","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919938","url":null,"abstract":"This paper presents a new quadrature voltage-controlled oscillator (QVCO), which consists of four cross-coupled voltage-controlled oscillators (VCOs) coupled by a loop inductor through magnetic coupling. The circuit design uses the concept of traveling wave and standing wave oscillators. The proposed CMOS QVCO has been implemented with the TSMC 0.18$mu$ m SiGe 3P6M technology and the die area is 1. $072 times 1$. 072mm2. At the supply voltage of 1V, the total power consumption is 5.33mW. The free-running frequency of the QVCO is tuneable from 3.26 GHz to 3.98 GHz as the tuning voltage is varied from 0.0V to 2V. The measured phase noise at 1MHz frequency offset is-122.143 dBc/Hz at the oscillation frequency of 3.26 GHz and the Figure of merit (FOM) of the proposed QVCO is-185.11 dBc/Hz.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125850624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Modeling of Electromagnetic Fault Injection 电磁故障注入建模
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919964
Mathieu Dumont, P. Maurine, M. Lisart
{"title":"Modeling of Electromagnetic Fault Injection","authors":"Mathieu Dumont, P. Maurine, M. Lisart","doi":"10.1109/EMCCompo.2019.8919964","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919964","url":null,"abstract":"Electromagnetic Fault Injection (EMFI) has recently gained popularity as a mean to induce faults because of its inherent advantages. Despite this popularity, there is only little information on how EMFI generates faults. Within this context, this paper aims at filling this lack by proposing a complete modeling of EM induction on Integrated Circuit (IC). The introduced model is confronted to experimental data in order to demonstrate its robustness.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114487331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fundamental Study on Influence of Intentional Electromagnetic Interference on IC Communication 有意电磁干扰对集成电路通信影响的基础研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919838
Hikaru Nishiyama, Takumi Okamoto, Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi
{"title":"Fundamental Study on Influence of Intentional Electromagnetic Interference on IC Communication","authors":"Hikaru Nishiyama, Takumi Okamoto, Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi","doi":"10.1109/EMCCompo.2019.8919838","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919838","url":null,"abstract":"Low-Power intentional electromagnetic interference (IEMI) has been reported to cause device malfunction without disrupting the device itself via an IEMI of several volts. In this paper, we intentionally generated errors on transmitted data between ICs using Low-Power IEMI to investigate possibilities of changes in the commands executed based on transmitted data. To evaluate impacts of the Low-Power IEMI threat on transmitted data between ICs, we applied Low-Power IEMI threat to the device via power distribution network with frequency and amplitude variation. The experiment results indicated that error occurrence probability of data errors in transmitted data changes in accordance with the number of Hamming Weights of data, frequency, and amplitude of the applied interference wave. Based on these results, we speculate the influence of voltage drop caused by applying Low-Power IEMI and output status in I/O circuits.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"254 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121880994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Lightning Protection Circuit Design in Power Supply Systems 供电系统中的防雷电路设计
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919731
Yin Sun, Lingyun Ye, K. Song, Xinglin Sun
{"title":"A Lightning Protection Circuit Design in Power Supply Systems","authors":"Yin Sun, Lingyun Ye, K. Song, Xinglin Sun","doi":"10.1109/EMCCompo.2019.8919731","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919731","url":null,"abstract":"The lightning surge can induce serious electromagnetic compatibility (EMC) problems of electronic devices, especially in the power supply systems. In this paper, a lightning protection circuit in power supply systems is proposed and verified. The proposed circuit design has good lightning protection effect and can be applied to the equipment with high electromagnetic protection requirements such as ships, submarines, and aircrafts.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123846796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Side Channel Leakage Information Based on Electromagnetic Emission of STM32 Micro-controller 基于STM32微控制器电磁发射的侧通道泄漏信息
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919716
Xu Zhijian, Tang Qiang, Song Yanyan, Zhang Dongyao, Zhou Changlin
{"title":"Side Channel Leakage Information Based on Electromagnetic Emission of STM32 Micro-controller","authors":"Xu Zhijian, Tang Qiang, Song Yanyan, Zhang Dongyao, Zhou Changlin","doi":"10.1109/EMCCompo.2019.8919716","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919716","url":null,"abstract":"This paper analyses the electromagnetic information conducted leakage mechanism of a typical single-chip microcontroller, tests and reconstructs raw information emission by micro-controllers. The direct-coupled signal detection method is used to collect the electromagnetic leakage information of the side channel to obtain the conduction coupling leakage waveform. Using the wavelet transform, feature information of the leakage signal is extracted. And the original information is reconstructed by using Support Vector Machine (SVM). The results show that the chip-level electromagnetic emission leakage is closely related to its working state, and the side channel is used to detect and analyze the leakage signal, which can reconstruct the original information and effectively know its internal working state.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123386988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
EMC COMPO 2019 Welcome Message From Chairs EMC COMPO 2019主席欢迎辞
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/emccompo.2019.8919709
{"title":"EMC COMPO 2019 Welcome Message From Chairs","authors":"","doi":"10.1109/emccompo.2019.8919709","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919709","url":null,"abstract":"","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"336 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134263950","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Revisiting EAVP for Power Delivery Decoupling Optimization 电力输送解耦优化的EAVP研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919705
Shenghao Liu, Baixin Chen, Cheng Zhuo
{"title":"Revisiting EAVP for Power Delivery Decoupling Optimization","authors":"Shenghao Liu, Baixin Chen, Cheng Zhuo","doi":"10.1109/EMCCompo.2019.8919705","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919705","url":null,"abstract":"As the semiconductor technology enters into sub14nm regime, very-large-scale-integration (VLSI) circuits are featured with increasing integration density and growing power consumption, thereby jeopardizing the robustness of a power delivery (PD) system. While decoupling capacitance (decap) insertion remains as the most effective method to mitigate transient noise of a PD system, too much decap insertion not only incurs additional cost but also adds up unnecessary leakage. It is highly desired to have an efficient optimization method for decoupling allocation. This paper revisits the conventional extended adaptive voltage positioning (EAVP) method but proposes new modeling and optimization schemes to overcome the impracticality and in-efficiency of EAVP. The modified EAVP can be integrated into a practical PD design flow and achieve 33.5% decoupling resource saving or 16.8% noise reduction.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128946994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An ICIM-CI Model Based IC EMS Evaluation Method for DSP IC in MMC-HVDC System 基于ICIM-CI模型的MMC-HVDC系统DSP集成电路EMS评价方法
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919904
Yidong Tian, Wenjie Chen, Xu Yang
{"title":"An ICIM-CI Model Based IC EMS Evaluation Method for DSP IC in MMC-HVDC System","authors":"Yidong Tian, Wenjie Chen, Xu Yang","doi":"10.1109/EMCCompo.2019.8919904","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919904","url":null,"abstract":"In this paper, the failure mechanism of DSP-based control circuits in high-voltage large-current modular multilevel converter (MMC) valve towers is studied. This study combines a low-voltage integrated circuit (IC) immunity model with a new perspective on electromagnetic interference (EMI) coupling effects. A new copper layer based coupling model of MMC valve tower combined with power system and digital control IC was established. By using the new model, the EMI introduced into the IC can be quantified. This advantage translates into a new DSP electromagnetic sensitivity (EMS) evaluation method that can be used as a guide for industrial applications.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130837824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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