{"title":"EMC COMPO 2019 Committees","authors":"","doi":"10.1109/emccompo.2019.8919774","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919774","url":null,"abstract":"","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124480120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Zhaoyang Feng, Chengming Wang, Quankun Chen, Er-Ping Li
{"title":"An Efficient Method of Calculating Inductance Using Near-Field Data","authors":"Zhaoyang Feng, Chengming Wang, Quankun Chen, Er-Ping Li","doi":"10.1109/EMCCompo.2019.8919814","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919814","url":null,"abstract":"Inductance coupling, caused by the mutual inductance between two circuits, is a very important factor in electromagnetic interference(EMI). While calculating the interference of a certain interference source to different locations, the traditional method is to simulate each location separately, which takes too long time and takes up more computer resources. This method is not conducive to the calculation of complex models, especially when it is necessary to calculate the mutual inductance of multiple locations in space. This paper proposes a new calculation method, which can quickly calculate the mutual inductance of the loop in any position on the space based on the simulation results, and save a lot of time while ensuring accuracy of results.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121226499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A Novel Frequency Selective Surface Applied for EMI Suppression in Integrated Circuit Package","authors":"Panpan Zuo, Hang Jin, Tianwu Li, E. Li","doi":"10.1109/EMCCompo.2019.8919751","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919751","url":null,"abstract":"Aiming on 10 GHz excessive radiation problem in IC package, a novel frequency selective surface (FSS) design is proposed in this paper. It is an ultrathin structure with only 0.0067λ0 thickness, with a good stopband centered at 10 GHz. The electromagnetic interference (EMI) reduction performance is tested on a patch antenna which works at 10 GHz. The simulation shows the electric field radiation is suppressed by 8 dB μV/m at 10 GHz.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116710995","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The SI and EMI Analysis of Sub-Femto-Farad readout circuit for capacitive sensor","authors":"X. Lai, Yuheng Wang, Mingming Liu, Lingfei Zhang","doi":"10.1109/EMCCompo.2019.8919907","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919907","url":null,"abstract":"Due to the scaling down of CMOS and MEMS technology, the variation of capacitance decreases to the sub-femto-farad level. The signal charge from sensing element is weak, it is vulnerable to the dynamic coupling interference. This interference generates error charge that significantly affects accuracy of signal transmission. It is a crucial problem that how to assure the signal integrity (SI) for such a high-precision readout circuit. This paper deals with SI and EMI analysis of MEMS capacitive sensor-accelerometer/inertial sensor. And the paper demonstrates how significantly the IC-layout can contribute to the EMC performance of sub-femto-farad readout circuit for MEMS capacitive sensor. The measurement results show that the precision IC-layout reduces the equivalent input offset and improve the EMC performance of the readout circuit.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116035126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Hai-Zhen Gao, Guang-Xiao Luo, H. Lin, Mingmin Zhao, Y. Ju
{"title":"Modeling of Small Common-mode Choke for EFT Interference Suppression at Analog Input Port","authors":"Hai-Zhen Gao, Guang-Xiao Luo, H. Lin, Mingmin Zhao, Y. Ju","doi":"10.1109/EMCCompo.2019.8919724","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919724","url":null,"abstract":"In this paper, a full circuit model of small common-mode choke is presented for the analog signal input port of Capacitor Voltage Transformer(CVT) equipment, and its protection performance is analyzed under Electrical Fast Transient(EFT) disturbance signals generated by the isolation switch operation in the power system. Firstly, the broadband impedance characteristics among the terminals of the choke coil were measured, the corresponding RLC circuit parameters are extracted. According to the frequency characteristics of the magnetic permeability and the impedance measurement results of the small choke coil, power function is proposed to describe the frequency-dependent variable resistance and inductance. Finally, the proposed full circuit model of the small choke coil was used to evaluate its suppression of EFT disturbance.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"53 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123198084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Josip Bačmaga, R. Blečić, Fabio Pareschi, G. Setti, A. Barić
{"title":"Impact of Dead Times on Radiated Emissions of Integrated and Discrete DC-DC Converter","authors":"Josip Bačmaga, R. Blečić, Fabio Pareschi, G. Setti, A. Barić","doi":"10.1109/EMCCompo.2019.8919946","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919946","url":null,"abstract":"An integrated synchronous buck converter, designed in a 0.18-μm high-voltage CMOS technology, is analyzed to investigate the impact of the dead times between the control signals on the radiated emissions. The designed converter enables to set the dead times of the control signals for both integrated or off-chip transistor switches. The test boards are designed to analyze the impact of dead times on radiated emissions for integrated and discrete synchronous buck converter. The radiated emissions of both integrated and discrete converter are measured in a semi-anechoic chamber.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114067723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Jianquan Lou, A. Bhobe, Hailong Zhang, Xiao Li, Yingchun Shu
{"title":"SERDES With Dual Output Buffer to Reduce Common Mode Noise","authors":"Jianquan Lou, A. Bhobe, Hailong Zhang, Xiao Li, Yingchun Shu","doi":"10.1109/EMCCompo.2019.8919783","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919783","url":null,"abstract":"The radiation of twice Nyquist frequency and its harmonics from SERDES link is a main EMI issue in high speed products such as core switch, it is caused by common mode current generated in SERDES link, which is due to the risetime and falltime mismatch between SERDES differential signals. The reason why risetime and falltime mismatch occur is demonstrated by analyzing the circuit of current mode logic (CML) output buffer of SERDES. A new proposal is presented in this paper to address the mismatch root cause in transistor level, followed by the illustration of the mechanism how to match the risetime and falltime at the very beginning of the noise source. This new method has very little impact on the chip real estate and power consumption, while can reduce the EMI noise significantly.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132532540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Shoaib, S. N. F. Zaidi, A. Shafqat, H. M. Cheema
{"title":"EMC/I Analysis of Miniaturized Bio-Mechanical Sports Wearables","authors":"N. Shoaib, S. N. F. Zaidi, A. Shafqat, H. M. Cheema","doi":"10.1109/EMCCompo.2019.8919820","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919820","url":null,"abstract":"This paper presents an optimized miniaturized bio-mechanical sports wearable PCB layout in compliance to effective electromagnetic compatibility (EMC) design principles. Separate ground plane is introduced using polygon pour and decoupling capacitor problem is addressed. Long traces carrying high frequency signals, which also become a source of un-intentional radiations, are minimized. Efforts are made to decrease loop area and to separate digital and analog signal traces. These modifications result in 32.45% reduction in Specific absorption rate (SAR). In order to further decrease SAR, carbon nano-filament based electromagnetic absorbing material sheet is incorporated. It caused an additional 85.86% reduction in SAR.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131836256","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Impact of Mode Propagation on Radiated Immunity Characterization in Commonly Used TEM Cells","authors":"M. Koohestani, M. Ramdani, R. Perdriau","doi":"10.1109/EMCCompo.2019.8919742","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919742","url":null,"abstract":"This paper investigates the impact of propagation modes on radiated immunity characterization inside most commonly used transverse electromagnetic (TEM) cells. The first six modes together with their corresponding cutoff frequencies in two standard open and closed cells are firstly introduced and presented. It is then followed by an immunity testing case study of the electromagnetic field behavior inside the cells at frequencies below and above the dominant mode. Results imply that, although not recommended in the IEC 61967-2 and 62132-2 immunity testing standards, it is actually feasible to use a TEM cell at frequencies above the dominant mode frequency if the equivalent ‖E‖-field level with respect to the input power is properly rescaled in close proximity to the IC pins whatever the location of the IC package. Moreover, due to the dependency of the location of norm maxima ‖E‖ and ‖H‖ to frequency, attention must be paid to the DUT location in the TEM cell for proper immunity assessment. This calls for the use of an open TEM cell for immunity testing as relocating the DUT position is impossible in the closed cell.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132670548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electromagnetic Radiation Suppression of Package Lid based on CSRR and Interdigital Structure","authors":"Zhi-yi Gao, Yan Li, E. Li, Jun-hua Gu","doi":"10.1109/EMCCompo.2019.8919693","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919693","url":null,"abstract":"In this paper, a novel miniaturized EBG package lid based on the Complementary Split Ring Resonator (CSRR) and the interdigital structure proposed. The proposed novel EBG package lid can effectively suppress the electromagnetic radiation in the specified frequency bandwidth. From the dispersion curve analysis of the unit module and the HFSS simulation of the 3D system, the electromagnetic radiation suppresses using the novel EBG package lid can reach 9.6dB. The simulation result shows the novel EBG structure has good suppression results and can effectively improve the system reliability.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128927318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}