An ICIM-CI Model Based IC EMS Evaluation Method for DSP IC in MMC-HVDC System

Abstract

In this paper, the failure mechanism of DSP-based control circuits in high-voltage large-current modular multilevel converter (MMC) valve towers is studied. This study combines a low-voltage integrated circuit (IC) immunity model with a new perspective on electromagnetic interference (EMI) coupling effects. A new copper layer based coupling model of MMC valve tower combined with power system and digital control IC was established. By using the new model, the EMI introduced into the IC can be quantified. This advantage translates into a new DSP electromagnetic sensitivity (EMS) evaluation method that can be used as a guide for industrial applications.