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2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)最新文献

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Electrothermal Effects on Reliability of Vertical Resistive Random Access Memory Array by Parallel Computing 并行计算对垂直电阻随机存取存储器阵列可靠性的电热影响
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919912
Hao Xie, G. Zhu, Xingxing Xu, Shuo Zhang, W. Yin, Wenchao Chen, Ya-zhou Chen, Jixin Chen
{"title":"Electrothermal Effects on Reliability of Vertical Resistive Random Access Memory Array by Parallel Computing","authors":"Hao Xie, G. Zhu, Xingxing Xu, Shuo Zhang, W. Yin, Wenchao Chen, Ya-zhou Chen, Jixin Chen","doi":"10.1109/EMCCompo.2019.8919912","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919912","url":null,"abstract":"A finite element method (FEM)-based simulator with capability of parallel computing is developed for Multiphysics modeling and simulation of resistive random access memory (RRAM) array. The thermal crosstalk effects of a high density vertically integrated RRAM array are investigated. Simulation results show that severe reliability problem may occur during the reset process for RRAM cells even without applied voltage which can be transferred from low resistance state to high resistance state by mistake and hence lose their stored information.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134505436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automated EMI measurement and data processing integration platform 自动化电磁干扰测量与数据处理集成平台
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919917
Shih-Yi Yuan, Po-Wei Huang, Chia-Hung Su
{"title":"Automated EMI measurement and data processing integration platform","authors":"Shih-Yi Yuan, Po-Wei Huang, Chia-Hung Su","doi":"10.1109/EMCCompo.2019.8919917","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919917","url":null,"abstract":"This paper develops a measurement platform that controls the detailed measurement process in response to information leakage measurement requirements, mainly through the integration of a robot arm and the measurement instruments to achieve the goal of automated measurement. The measurement result is EMI distribution on the transient current of a test circuit board. This method is used for the acquisition of complex EMI data for machine learning algorithms, and the data is obtained through a large amount of comprehensive information.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114469356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Comprehensive Study of a Bidirectional ESD Protection Device Under Harsh Environment 恶劣环境下双向ESD保护装置的综合研究
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919822
Zhuojun Chen, Zhiqiang Wu, Ming Wu, W. Peng, Yun Zeng, Xiangliang Jin, Binhong Li, Bo Li
{"title":"A Comprehensive Study of a Bidirectional ESD Protection Device Under Harsh Environment","authors":"Zhuojun Chen, Zhiqiang Wu, Ming Wu, W. Peng, Yun Zeng, Xiangliang Jin, Binhong Li, Bo Li","doi":"10.1109/EMCCompo.2019.8919822","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919822","url":null,"abstract":"The dual-direction silicon controlled rectifier (DDSCR) is commonly used to protect input/output (I/O) interface circuits from electrostatic discharge (ESD). This work mainly focuses on the variations of ESD protection capability under harsh environment. Transmission line pulse (TLP) tests are performed on the devices right after gamma-ray irradiation, and the measurements are also conducted at different temperatures. This work gives an insight into the combined effects of total-ionizing dose and ESD stress, as well as the impact of elevated temperature on the DDSCR.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116992253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC COMPO 2019 Technical Sessions EMC COMPO 2019技术会议
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/emccompo.2019.8919844
{"title":"EMC COMPO 2019 Technical Sessions","authors":"","doi":"10.1109/emccompo.2019.8919844","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919844","url":null,"abstract":"","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"82 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120835163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reconfigurable Negative Group Delay Circuits Based on Distributed Amplifiers for Guided- and Radiated- Wave Applications 基于分布式放大器的可重构负群延迟电路在导波和辐射波中的应用
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919940
Minning Zhu, C. Wu
{"title":"Reconfigurable Negative Group Delay Circuits Based on Distributed Amplifiers for Guided- and Radiated- Wave Applications","authors":"Minning Zhu, C. Wu","doi":"10.1109/EMCCompo.2019.8919940","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919940","url":null,"abstract":"A recent development of reconfigurable negative group delay (NGD) circuit design based on distributed amplifiers (DA) is introduced. By incorporating varactors at the input and output port of the DA-based NGD circuit, tunable non-Foster elements - negative capacitors and non-Foster T-networks, can be realized. The negative capacitor can be tuned to realize an effective capacitance between −0.5 pF and −1.0 pF within a bandwidth of 100 MHz. For the non-Foster T-network, the tuning range is from 0.0 pF to −1.5 pF for the shunt capacitor, and 0 nH to −1.875 nH for the series inductor. Furthermore, the DA-based reconfigurable NGD circuit can also be utilized as antenna feedlines to realize squint free beam steering for antenna arrays.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127439662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC COMPO 2019 Table of Contents EMC COMPO 2019目录
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/emccompo.2019.8919873
{"title":"EMC COMPO 2019 Table of Contents","authors":"","doi":"10.1109/emccompo.2019.8919873","DOIUrl":"https://doi.org/10.1109/emccompo.2019.8919873","url":null,"abstract":"","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126739284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimization of LDMOS-SCR Device For ESD Protection Based On 0.5 μm CMOS Process 基于0.5 μm CMOS工艺的LDMOS-SCR ESD保护器件优化
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919854
Xiangliang Jin, Yang Wang, Zeyu Zhong
{"title":"Optimization of LDMOS-SCR Device For ESD Protection Based On 0.5 μm CMOS Process","authors":"Xiangliang Jin, Yang Wang, Zeyu Zhong","doi":"10.1109/EMCCompo.2019.8919854","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919854","url":null,"abstract":"The LDMOS-SCR(lateral double diffused MOSFET Silicon controlled rectifiers) device structure is fabricated based on a standard CMOS(Complementary Metal Oxide Semiconductor) process, the device is used for unidirectional ESD protection of single photon detectors. According to the principle of equivalent circuit and TCAD(Technology Computer Aided Design) simulation to predict the ESD behavior of the device, and use the transmission line pulse(TLP) for device testing. The results show that the trigger voltage of the LDMOS-SCR device is 19V, the sustain voltage is $3mathrm {V} sim 7mathrm {V}$, and the failure current is 7A $sim 11mathrm {A}$. In this paper, the partial dimensions of the device are changed, and the ESD indicators of LDMOS-SCR under different sizes are obtained and discussed and analyzed.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114196553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electromagnetic Radiation Suppression of Package Lid based on CSRR and Interdigital Structure 基于CSRR和数字间结构的封盖电磁辐射抑制
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919858
Zhi-yi Gao, Yan Li, E. Li, Jun-hua Gu
{"title":"Electromagnetic Radiation Suppression of Package Lid based on CSRR and Interdigital Structure","authors":"Zhi-yi Gao, Yan Li, E. Li, Jun-hua Gu","doi":"10.1109/EMCCompo.2019.8919858","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919858","url":null,"abstract":"In this paper, a novel miniaturized EBG package lid based on the Complementary Split Ring Resonator (CSRR) and the interdigital structure proposed. The proposed novel EBG package lid can effectively suppress the electromagnetic radiation in the specified frequency bandwidth. From the dispersion curve analysis of the unit module and the HFSS simulation of the 3D system, the electromagnetic radiation suppresses using the novel EBG package lid can reach 9.6dB. The simulation result shows the novel EBG structure has good suppression results and can effectively improve the system reliability.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125149473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Crosstalk Noise Characterization Between Spoof SPP Transmission Line and Differential Microstrip Lines 欺骗SPP传输线与差分微带线之间的串扰噪声特性
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919863
Meini Wang, M. Tang, Junfa Mao, Hao Chi Zhang, T. Cui
{"title":"Crosstalk Noise Characterization Between Spoof SPP Transmission Line and Differential Microstrip Lines","authors":"Meini Wang, M. Tang, Junfa Mao, Hao Chi Zhang, T. Cui","doi":"10.1109/EMCCompo.2019.8919863","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919863","url":null,"abstract":"In this paper, the crosstalk noise between spoof surface plasmon polariton (SPP) transmission line (TL) and conventional differential microstrip (MS) lines is investigated. Due to the strong field confinement of spoof SPP TL, as well as the mode mismatching between the spoof SPP TL and conventional MS lines, the transmitting electromagnetic energy of spoof SPP TL can hardly be coupled to adjacent differential MS lines, which helps reduce the crosstalk noise between them effectively. The full-wave simulated results show that the crosstalk noise suppression is much better than the MS line. In addition, the time domain simulated results illustrate that both differential mode and common mode noises of adjacent differential pairs are significant reduced when spatially designed spoof SPP TL is utilized.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125284291","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analytical Derivations of the TDR Expressions of Lossy Transmission Lines with the Other End Perfectly Matched 另一端完全匹配的损耗传输线TDR表达式的解析推导
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Pub Date : 2019-10-01 DOI: 10.1109/EMCCompo.2019.8919837
Jun Zhang, Dong Xu Fu, Miao-miao Bian, Xiao-Ding Cai, Bidyut Sen
{"title":"Analytical Derivations of the TDR Expressions of Lossy Transmission Lines with the Other End Perfectly Matched","authors":"Jun Zhang, Dong Xu Fu, Miao-miao Bian, Xiao-Ding Cai, Bidyut Sen","doi":"10.1109/EMCCompo.2019.8919837","DOIUrl":"https://doi.org/10.1109/EMCCompo.2019.8919837","url":null,"abstract":"This paper gives the analytical derivations of the TDR expressions of lossy transmission lines with the other end perfectly matched. The accuracies of the expressions are verified by two numerical examples. The derivations in this paper can reveal the physical meaning of the TDR and its properties very clearly. And with some more efforts based on our work, the expressions obtained can be used in removing the interference of the conductor loss to the measured TDR.","PeriodicalId":252700,"journal":{"name":"2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122705698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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