A high-precision thermal imaging approach based on Bayesian inference for EMC diagnosis

C. Ning, Hou Yaochun, Wu Dazhuan, Zhu Sha, Luo Dingxin
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引用次数: 1

Abstract

Electro Magnetic Compatibility (EMC) is sensitive to some of unapparent factors such as current leakage, component heating and temperature fluctuation etc. In recent years, thermal imaging techniques with high precision has been investigated for EMC diagnosis due to these unapparent factors. This paper presents a Bayesian inference based thermal imaging approach so as to calibrate temperature distortion on the surface of electronic device. The proposed method improves the thermal radiation model by studying raw data property and updating the model parameters such as measure distance, surrounding humidity, ambient temperature and surface emissivity. Thermal imaging results on ABB controllers and Schneider switches etc. validate the advantages of our proposals in the sense of high-precision, far-field detection and wide-range inspection for EMC enhancement.
基于贝叶斯推理的高精度热成像电磁兼容诊断方法
电磁兼容性(EMC)对漏电流、元件发热和温度波动等不明显因素很敏感。由于这些不明显的因素,近年来人们开始研究高精度的热成像技术来诊断电磁兼容。本文提出了一种基于贝叶斯推理的热成像方法,用于标定电子器件表面的温度畸变。该方法通过研究原始数据的性质和更新模型参数,如测量距离、周围湿度、环境温度和表面发射率等,对热辐射模型进行改进。ABB控制器和施耐德开关等的热成像结果验证了我们的方案在高精度、远场检测和大范围检测方面的优势,从而增强了EMC。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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