Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces最新文献_第2页

Hydrolytically stable aluminum nitride as a filler material for polymer based electronic packaging 水解稳定的氮化铝作为聚合物基电子封装的填充材料

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581266

K. E. Howard, A. Knudsen

引用次数: 1

Materials in next generation of packaging 新一代包装材料

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581241

R. Tummala, C. Wong

{"title":"Materials in next generation of packaging","authors":"R. Tummala, C. Wong","doi":"10.1109/ISAPM.1997.581241","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581241","url":null,"abstract":"The Packaging Research Center (PRC) was established to explore, develop, and prototype the next generation of electronic packaging technologies and to produce a new breed of globally competitive engineers thereby providing both the technological and human resources necessary to enable 10/spl times/ improvements in size, cost, performance, and reliability of next generation electronic products. The research vision parallels what integrated circuits did for transistors - ever increasing integration while maintaining constant manufacturing costs. The strategy is a systems-level approach with a balanced combination of fundamental, applied, cross-disciplinary, and prototype research to overcome the technological barriers. The cross-disciplinary research efforts are integrated into four focused research areas: (1) Systems Integration, Design, and Test; (2) Low-cost, Integrated Substrate; (3) Optoelectronics and Wireless Electronics; and (4) Assembly, Reliability, and Thermal Management. Materials form the \"heart and soul\" of next generation of packaging and include enhanced materials for printed wiring board, interlayer dielectrics, integrated capacitors, resistors and inductors, flipchip solder joints and alternatives, underfills and encapsulants and heat-transfer materials.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"287 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116512359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

A novel thick film materials technology offering high performance packaging solutions 提供高性能包装解决方案的新型厚膜材料技术

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581285

P. Barnwell

引用次数: 1

Characterizing the failure envelope of a conductive adhesive 表征导电胶粘剂的失效包络

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581274

D. Olliff, M. Gaynes, R. Kodnani, A. Zubelewicz

引用次数: 11

A screen printable silicone-imide paste for high performance coatings and adhesives 一种用于高性能涂料和粘合剂的可丝网印刷硅-亚胺浆料

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581255

Jin-O Choi, R. Kirsten, S. Rojstaczer, D. Riordan

引用次数: 1

Mechanical properties of Sn-In and Pb-In solders at low temperature Sn-In和Pb-In钎料的低温力学性能

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581258

W. Jones, Y.Q. Liu, M. Shah

{"title":"Mechanical properties of Sn-In and Pb-In solders at low temperature","authors":"W. Jones, Y.Q. Liu, M. Shah","doi":"10.1109/ISAPM.1997.581258","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581258","url":null,"abstract":"The growing number of applications using high temperature superconductors (HTS) has created new requirement for increasing the range of temperatures in which electronic assemblies can operate. Typically, eutectic lead-tin solders lose ductility below -150/spl deg/C. In this paper, new solder formulations were evaluated for cryogenic applications. The mechanical properties of PbIn and Sn-In solders were determined over the temperature range -200/spl deg/C to 100/spl deg/C using the uniaxial tensile test, with the following results. The strength of two types of solder increases almost linearly with decreasing temperature. However, it was evident that the Sn-In alloying solders possess higher strength than the Pb-In (50 Pb/50 In) solder at low temperatures. For both types of solder, the total elongation decreases with decreasing temperature, and all of the solders displayed superplasticity at temperatures greater than 50/spl deg/C. There was also doubling of the uniform elongation below -50/spl deg/C for all of the tested solders. The deformation and fracture processes of the solders were investigated, and their fracture mechanism is proposed.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122453492","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Advanced encapsulation processing for low cost electronics assembly-a cost analysis 用于低成本电子组装的先进封装工艺——成本分析

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581253

N. W. Pascarella, D. Baldwin

{"title":"Advanced encapsulation processing for low cost electronics assembly-a cost analysis","authors":"N. W. Pascarella, D. Baldwin","doi":"10.1109/ISAPM.1997.581253","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581253","url":null,"abstract":"Major cost driving factors for current advanced electronics assembly processes are polymer encapsulation and polymer dispensing processing. This is particularly true for flip chip on board interconnection technology. As an integral part of the Low Cost Next Generation Flip Chip Processing Program of Georgia Tech's Packaging Research Center, a preliminary industry benchmark study has been conducted to determine high cost process characteristics of state-of-the-art flip chip assembly technology. The benchmarking analysis has identified certain steps of the assembly process as high cost including bumping, underfill dispensing and curing of underfill material. Based on these cost factors, a new flip chip assembly process concept has been developed to reduce process steps, process time, and cost. A cost model has been created to analyze the new assembly process and compare it with current benchmark processes. Leveraging the cost analysis, further cost reducing refinements to the process have been identified achieving a low cost solution. The work presented will focus on flip chip assembly cost analysis and process design.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131022209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Integration of polymer/ceramic thin film capacitor on PWB 聚合物/陶瓷薄膜电容器在PWB上的集成

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581259

S. Bhattacharya, R. Tummala, P. Chahal, G. White

引用次数: 11

Electrical performance in time domain of subminiature interconnections on new thin films 新型薄膜上超小型互连的时域电学性能

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581279

R. Salik, P. Ferrari, A. Chosson, G. Angnieux

引用次数: 0

Primerless RTV silicones for electronic protection 用于电子保护的无底漆RTV有机硅

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581254

B. Van Wert, J. Fiori

引用次数: 0