Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces最新文献_第5页

Trends in lead frame technology for plastic packaging 塑料包装引线框架技术的发展趋势

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581265

D. Mahulikar

{"title":"Trends in lead frame technology for plastic packaging","authors":"D. Mahulikar","doi":"10.1109/ISAPM.1997.581265","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581265","url":null,"abstract":"Lead frames make up the largest portion of the materials costs in plastic packages; especially Quad Flat Packages (QFP's). For stamping lead frames the costs can be up to 60% of total while for etched lead frames it can run up to 75% of total. Additionally, from performance perspectives lead-frames are a critical component of the packaging system. Lead frames must be strong to withstand handling, yet compliant to tolerate bending. They must have high thermal conductivity to dissipate heat generated by the IC device and good electrical properties so as not to deteriorate the IC device performance. In addition, lead frames are a critical part of the reliability of the overall packaging system. Lead frame properties can affect solder joint fatigue, delamination in moisture tests, and wire bonding integrity. The SIA and SEMATECH packaging road maps represent significant new challenges for lead frames. In upcoming years not only lead frame materials will have to be stretched to their limits, but it will have to be done much more cost effectively. The TRP Low-Cost Packaging Consortium looked at two critical areas: very high strength reasonable conductivity alloy development and adhesion improvements for delamination resistance. This paper discusses lead frame technology trends to the year 2000 and TRP development work to date.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132793354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A new design-for-reliability approach to thermal fatigue life prediction of leadless solder joints 无铅焊点热疲劳寿命预测的可靠性设计新方法

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581276

Y. Pao, E. Jih, R. Liu, V. Siddapureddy, X. Song, R. McMillan, J.M. Hu

引用次数: 1

Practical applications of photo-defined micro-via technology (PhotoLink/sup TM/) 照片定义微孔技术的实际应用(PhotoLink/sup TM/)

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581246

B. McDermott, Sid Tryzbiak

引用次数: 1

Colamination technology for electronic packaging applications 用于电子封装的叠合技术

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581250

S. Leach, C.N. Ernsberger

引用次数: 1

Laser machining of ceramics and silicon for MCM-D applications 用于MCM-D应用的陶瓷和硅激光加工

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581287

V. Glaw, R. Hahn, A. Paredes, U. Hein, O. Ehrmann, H. Reichl

引用次数: 6

Molecular insights on interfacial properties and moisture uptake of plastic packaging materials 塑料包装材料界面特性和吸湿性的分子研究

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581263

M. Schen, Wen-Li Wu, W. Wallace, N. Beck-Tan, D. Vanderhart, G. T. Davis

{"title":"Molecular insights on interfacial properties and moisture uptake of plastic packaging materials","authors":"M. Schen, Wen-Li Wu, W. Wallace, N. Beck-Tan, D. Vanderhart, G. T. Davis","doi":"10.1109/ISAPM.1997.581263","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581263","url":null,"abstract":"Product trends such as chip scale packaging and high density electronic interconnects are driving technologies towards increased complexity and reduced feature sizes. Two particularly important technical challenges involving plastic packages are to enhance the robustness of multi-component material interfaces and to improve the resistance of plastic assemblies to the effects of moisture. This presentation will review recent insights gained at NIST within its electronic packaging, interconnection and assembly program. First, a discussion of the properties and moisture susceptibility of buried polymer interfaces is presented. Using neutron and X-ray reflectivity techniques, NIST can directly measure the CTE and hygroscopic expansion of extremely thin polymer films. Neutron techniques can also yield information about the concentration profile of deuterated water near an interface. Second, results from moisture uptake and egress studies within a molding compound are also presented. Using solid state NMR, NIST can detect different forms of absorbed water and observe how this water responds to changes in the external environment.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-03-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114303031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Advanced encapsulant systems for flip chip 用于倒装芯片的先进封装系统

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI: 10.1109/ISAPM.1997.581252

D. Gamota, C. Melton

引用次数: 11

Low cost solder flip chip 低成本焊料倒装芯片

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1900-01-01 DOI: 10.1109/ISAPM.1997.581270

G. Rinne, P. Magill

引用次数: 0

A comprehensive study on 40-mil PBGA 40mil PBGA的综合研究

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1900-01-01 DOI: 10.1109/ISAPM.1997.581257

R. T. Chen, Yukon Chou, T. Ho, P. Chiang, C. Chao, Wun-Yan Chen

{"title":"A comprehensive study on 40-mil PBGA","authors":"R. T. Chen, Yukon Chou, T. Ho, P. Chiang, C. Chao, Wun-Yan Chen","doi":"10.1109/ISAPM.1997.581257","DOIUrl":"https://doi.org/10.1109/ISAPM.1997.581257","url":null,"abstract":"The 40-mil PBGA is an effective application for higher I/O density. In regular consideration, the pad size and the solder sphere should be smaller due to decreasing the bump pitch from 50 or 60 mils to 40-mil PBGA. Until now, we could not find any standard product or paper which refers to pad size and solder sphere diameter. So we setup this experiment to find out the results and hope it will be useful to build-up the optimal bumping process of 40-mil PBGA. In this study, we considered many different factors such as substrate pad size and solder sphere diameter. In order to find out the best combination of all these factors to achieve the highest manufacturing yield, we applied the thermocouple technology to measure the thermal distribution of the entire substrate in reflow furnace. After bumping the solder ball onto the substrate, we use ball shear test to analyze the force difference between the balls caused by different temperature profile. The shear height and shear speed variables of the ball shear testing are also investigated in this study. The x-section technology was applied in this experiment for examining the bump shape after finishing the bumping process. In this study, we also utilize the noncontact laser technology to examine the bump height after solder bumping process. In order to understand data about SMT application of 40-mil PBGA, the solder joint height with different solder ball diameter and the reliability test data were both included in this experiment. Of course, we design a test board with daisy chain and utilize the x-section technology to achieve the jobs.","PeriodicalId":248825,"journal":{"name":"Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131138227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0